IXD_614 CLARE [Clare, Inc.], IXD_614 Datasheet

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IXD_614

Manufacturer Part Number
IXD_614
Description
14-Ampere Low-Side Ultrafast MOSFET Drivers
Manufacturer
CLARE [Clare, Inc.]
Datasheet

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Part Number:
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Clare
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Features
Applications
Ordering Information
DS-IXD_614-R02
Part Number
IXDD614PI
IXDD614SI
IXDD614SITR
IXDD614CI
IXDD614YI
IXDI614PI
IXDI614SI
IXDI614SITR
IXDI614CI
IXDI614YI
IXDN614PI
IXDN614SI
IXDN614SITR
IXDN614CI
IXDN614YI
14A Peak Source/Sink Drive Current
Wide Operating Voltage Range: 4.5V to 35V
-40°C to +125°C Extended Operating Temperature
Range
Logic Input Withstands Negative Swing of up to 5V
Low Propagation Delay Time
Low, 10A Supply Current
Low Output Impedance
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
Pb
2002/95/EC
RoHS
IN
EN
IN
Configuration
IN
Logic
e
3
OUT
OUT
OUT
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
www.clare.com
Package Type
5-Pin TO-220
5-Pin TO-263
5-Pin TO-220
5-Pin TO-263
5-Pin TO-220
5-Pin TO-263
8-Pin DIP
8-Pin DIP
8-Pin DIP
Description
The IXDD614 / IXDI614 / IXDN614 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. Each output can source
and sink 14A of peak current while producing voltage
rise and fall times of less than 30ns. Internal circuitry
eliminates cross-conduction and current
"shoot-through," making the driver virtually immune to
latch up. Low propagation delay with fast rise and fall
times make the IXD_614 family ideal for
high-frequency and high-power applications.
The IXDD614 is configured as a non-inverting driver
with an enable. The IXDN614 is configured as a
non-inverting driver, and the IXDI614 is configured as
an inverting driver.
The IXD_614 family is available in an 8-pin DIP (PI),
an 8-pin Power SOIC with an exposed metal back (SI),
a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package.
Ultrafast MOSFET Drivers
14-Ampere Low-Side
Tape & Reel
Tape & Reel
Tape & Reel
Packing
Method
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
IXD_614
Quantity
2000
2000
2000
100
100
100
50
50
50
50
50
50
50
50
50
1

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IXD_614 Summary of contents

Page 1

... The IXDD614 is configured as a non-inverting driver with an enable. The IXDN614 is configured as a non-inverting driver, and the IXDI614 is configured as an inverting driver. The IXD_614 family is available in an 8-pin DIP (PI), an 8-pin Power SOIC with an exposed metal back (SI), a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package. Package Type ...

Page 2

... Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.3 Reflow Profile 5.4 Mechanical Dimensions 5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back 5.4.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.4.3 YI (5-Pin TO-263 5.4.4 CI (5-Pin TO-220 5.4.5 PI (8-Pin DIP www.clare.com IXD_614 R02 ...

Page 3

... Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT Supply Voltage - Provides power to the device Ground - Common ground reference for the device Not connected Maximum Units -0 +0 ±14 A °C -55 +150 -65 +150 °C Maximum Units V 4.5 35 -40 +125 °C IXD_614 3 ...

Page 4

... Typical Maximum V 3 2/3V - ENH ENL V V -0.025 - 0.025 0 0 ENOH DOLD R - 200 < <1 IXD_614 Units - V 0.8 A ± 0.8  0.6 ± k A 10 R02 ...

Page 5

... Minimum Maximum ± -0.025 - 0.025 1 1 ± ENOH DOLD - 150 CC - 150 Symbol Rating 36 125   IXD_614 Units V A V  A Units °C/W °C/W 5 ...

Page 6

... Performance 2.1 Timing Diagrams ONDELAY 90% OUT 10 2.2 Characteristics Test Diagram + V CC 0.1μF 10μ OFFDELAY OUT GND V IN www.clare.com OFFDELAY ONDELAY 90% 10 OUT Tektronix Current Probe C 6302 LOAD IXD_614 t R R02 ...

Page 7

... Block Diagrams & Truth Tables 3.1 IXDD614 open open x 0 3.2 IXDI614 IN IN OUT 0 1 R02 3.3 IXDN614 V CC OUT IN GND OUT OUT GND 1 0 www.clare.com IXD_614 V CC OUT GND IN OUT ...

Page 8

... Temperature (ºC) Enable Threshold vs. Supply Voltage 25 20 Min V ENH Supply Voltage (V) IXD_614 =3.6nF, V =18V 100 120 140 =18V OFFDLY t ONDLY 80 100 120 140 Max V ENL R02 ...

Page 9

... Temperature (ºC) Output Sink Current vs. Supply Voltage (C =330nF Supply Voltage (V) IXD_614 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 1000 10000 3.5V 5V 10V 0V & 18V ...

Page 10

... Temperature (ºC) Low-State Output Resistance @ +10mA vs. Supply Voltage 0.7 0.6 0.5 0.4 0.3 0.2 0 Supply Voltage (V) www.clare.com Output Sink Current vs. Temperature (C =330nF, V =18V 100 120 140 Temperature (ºC) vs. Supply Voltage Supply Voltage (V) IXD_614 R02 ...

Page 11

... This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. IXD_614SI / IXD_614PI /IXD_614CI / IXD_614YI 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625 ...

Page 12

... Recommended PCB Land Pattern ∅1.55 ± 0.05 1.75 ± 0.10 5.50 ± 0.10 A ∅1.50 (MIN) 8.00 ± 0.10 (70º) NOTES & B measured at 0.3mm above base of pocket pitches cumulative tol. ± 0.2mm Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. IXD_614 1.55 0.60 (0.024) 12.00 ± 0.30 R02 ...

Page 13

... Recommended PCB Pattern 10.40 (0.409) 9.15 (0.360) 3.65 (0.144) 6.35 (0.250) 3.85 (0.152) 1.70 1.05 (0.067) (0.041) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 7.823 (0.308) 12.387 (0.487) 6.299 (0.248) 3 6.502 (0.256) 7.620 12.70 / 14.73 (0.300) (0.50 / 0.58) Recommended Hole Pattern Finished Hole Diameter = 1.45mm (0.057 in.) 1.70mm (0.067 in.) IXD_614 13 ...

Page 14

... NOTE: Molded package conforms to JEDEC standard configuration MS-001 variation BA. www.clare.com 8-0.900 DIA. 2.540 (8-0.035 DIA.) (0.100) 1.40 (0.055) PC Board Pattern Dimensions mm MIN / mm MAX (inches MIN / inches MAX) Specification: DS-IXD_614-R02 ©Copyright 2011, Clare, Inc. All rights reserved. Printed in USA. 8/16/2011 IXD_614 7.50 (0.295) R02 ...

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