IXD_609 CLARE [Clare, Inc.], IXD_609 Datasheet

no-image

IXD_609

Manufacturer Part Number
IXD_609
Description
9-Ampere Low-Side Ultrafast MOSFET Drivers
Manufacturer
CLARE [Clare, Inc.]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IXD_609IXDD609SI
Manufacturer:
PMC
Quantity:
4 300
Part Number:
IXD_609IXDD609SIA
Manufacturer:
IXYS
Quantity:
3 144
Part Number:
IXD_609IXDD609SIA
Manufacturer:
Clare
Quantity:
1 870
Part Number:
IXD_609IXDD609SIA
Manufacturer:
IXYS/艾赛斯
Quantity:
20 000
Part Number:
IXD_609IXDN609PI
Manufacturer:
IXYS
Quantity:
1 953
Part Number:
IXD_609IXDN609SIATR
Manufacturer:
IXYS/艾赛斯
Quantity:
20 000
Part Number:
IXD_609IXDN609SIATR
0
Company:
Part Number:
IXD_609IXDN609SIATR
Quantity:
8 000
Part Number:
IXD_609IXDN609YI
0
Features
Applications
Ordering Information
DS-IXD_609-R02
Part Number
IXDD609D2TR
IXDD609SI
IXDD609SITR
IXDD609SIA
IXDD609SIATR
IXDD609PI
IXDD609CI
IXDD609YI
IXDI609SI
IXDI609SITR
IXDI609SIA
IXDI609SIATR
IXDI609PI
IXDI609CI
IXDI609YI
IXDN609SI
IXDN609SITR
IXDN609SIA
IXDN609SIATR
IXDN609PI
IXDN609CI
IXDN609YI
9A Peak Source/Sink Drive Current
Wide Operating Voltage Range: 4.5V to 35V
-40°C to +125°C Extended Operating Temperature
Range
Logic Input Withstands Negative Swing of up to 5V
Matched Rise and Fall Times
Low Propagation Delay Time
Low, 10A Supply Current
Low Output Impedance
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
Pb
2002/95/EC
RoHS
EN
IN
IN
IN
Configuration
Logic
e
3
OUT
OUT
OUT
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
www.clare.com
Package Type
5-Pin TO-220
5-Pin TO-263
5-Pin TO-220
5-Pin TO-263
5-Pin TO-220
5-Pin TO-263
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
8-Pin DIP
8-Pin DIP
8-Pin DIP
Description
The IXDD609/IXDI609/IXDN609 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. The IXD_609
high-current output can source and sink 9A of peak
current while producing voltage rise and fall times of
less than 25ns. The input is CMOS compatible, and is
virtually immune to latch up. Proprietary circuitry
eliminates cross-conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_609 family
ideal for high-frequency and high-power applications.
The IXDD609 is configured as a non-inverting driver
with an enable, the IXDN609 is configured as a
non-inverting driver, and the IXDI609 is configured as
an inverting driver.
The IXD_609 family is available in a standard 8-pin
DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC
with an exposed metal back (SI); an 8-pin DFN (D2); a
5-pin TO-263 (YI); and a 5-pin TO-220 (CI).
Ultrafast MOSFET Drivers
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
9-Ampere Low-Side
Packing
Method
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
Tube
IXD_609
Quantity
2000
2000
2000
2000
2000
2000
2000
100
100
100
100
100
100
50
50
50
50
50
50
50
50
50
1

Related parts for IXD_609

IXD_609 Summary of contents

Page 1

... IXDN609 is configured as a non-inverting driver, and the IXDI609 is configured as an inverting driver. The IXD_609 family is available in a standard 8-pin DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC with an exposed metal back (SI); an 8-pin DFN (D2); a 5-pin TO-263 (YI); and a 5-pin TO-220 (CI). ...

Page 2

... A 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.3 Reflow Profile 5.4 Mechanical Dimensions www.clare.com IXD_609 R02 ...

Page 3

... Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT Supply Voltage - Provides power to the device CC Ground - Common ground reference for the device NC Not connected Minimum Maximum Units -0 +0 ±9 A °C -55 +150 -65 +150 °C Minimum Maximum Units 4 -40 +125 °C IXD_609 3 ...

Page 4

... 0.025 1 ± ondly offdly ENOH DOLD - 2 150 CC - 150 IXD_609 Units - V 0.8 A ±  0.8 ± k A 10 Units V A V  A R02 ...

Page 5

... Thermal Characteristics Package D2 (8-Pin DFN) CI (5-Pin TO-220) PI (8-Pin DIP) SI (8-Pin Power SOIC) SIA (8-Pin SOIC) YI (5-Pin TO-263) CI (5-Pin TO-220) SI (8-Pin Power SOIC) YI (5-Pin TO-263) 2 IXD_609 Performance 2.1 Timing Diagrams ondly 90% OUT 10 2.2 Characteristics Test Diagram + V CC 0.1μF 10μF - R02 ...

Page 6

... Block Diagrams & Truth Tables 3.1 IXDD609 open open x 0 3.2 IXDI609 IN IN OUT 3.3 IXDN609 V CC OUT GND OUT OUT GND 1 0 www.clare.com IN IN OUT IXD_609 V CC OUT GND R02 ...

Page 7

... Temperature (ºC) Enable Threshold vs. Supply Voltage 25 20 Min Supply Voltage (V) IXD_609 =2.5nF 100 120 140 =5.4nF 100 120 140 ENH Max V ENL ...

Page 8

... L C =1.5nF 0.1 0.01 10000 1 10 100 Frequency (kHz) Dynamic Supply Current vs. Temperature =18V, f=1kHz, C =1.5nF 100 120 140 Temperature (ºC) Output Sink Current vs. Supply Voltage (f=422Hz, C =66nF Supply Voltage (V) IXD_609 10000 1000 10000 R02 ...

Page 9

... Temperature (ºC) vs. Supply Voltage (I = -10mA) OUT 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0 Supply Voltage (V) www.clare.com Output Sink Current vs. Temperature (V =18V, f=422Hz, C =66nF 100 120 140 Temperature (ºC) Low State Output Resistance vs. Supply Voltage (I = +10mA ) OUT Supply Voltage (V) IXD_609 9 ...

Page 10

... This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. IXD_609SI / IXD_609SIA / IXD_609PI /IXD_609CI / IXD_609YI 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625 ...

Page 11

... MIN / mm MAX (inches MIN / inches MAX) NOTES: 1. Molded package conforms to JEDEC standard configuration MS-012 variation BA. 2. The exposed metal pad on the back of the SI package should be connected to GND not suitable for carrying current. www.clare.com IXD_609 1.27 (0.050) 5.40 1.55 (0.213) (0.061) 0.60 (0.024) Recommended PCB Land Pattern 3 ...

Page 12

... Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. Recommended PCB Pattern 10.40 (0.409) 9.15 (0.360) 3.65 (0.144) 6.35 (0.250) 3.85 (0.152) 1.70 1.05 (0.067) (0.041) DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) IXD_609 5.50 ± 0.10 12.00 ± 0.30 R02 ...

Page 13

... DIA. 2.540 (8-0.035 DIA.) (0.100) 1.40 (0.055) PC Board Pattern Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 7.823 (0.308) 12.387 (0.487) 6.299 (0.248) 3 6.502 (0.256) 7.620 12.70 / 14.73 (0.300) (0.50 / 0.58) Recommended Hole Pattern Finished Hole Diameter = 1.45mm (0.057 in.) 1.70mm (0.067 in.) IXD_609 7.50 (0.295) 13 ...

Page 14

... NOTES & B measured at 0.3mm above base of pocket. A =4.25 ± 0. pitches cumulative tol. ± 0.2mm Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. Specification: DS-IXD_609-R02 ©Copyright 2011, Clare, Inc. All rights reserved. Printed in USA. 8/16/2011 IXD_609 5.50 ± 0.05 12.00 ± 0.30 R02 ...

Related keywords