ax50424 AXSEM, ax50424 Datasheet - Page 36

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ax50424

Manufacturer Part Number
ax50424
Description
Advanced Multi-channel Single Chip Uhf Receiver
Manufacturer
AXSEM
Datasheet
36
QFN28 Package Information
8.2.
25°C
Version 1.3
T
T
T
T
p
L
sMAX
sMIN
Notes:
QFN28 Soldering Profile
Profile Feature
Average Ramp-Up Rate
Preheat Preheat
Temperature Min
Temperature Max
Time (T
Time 25°C to Peak Temperature
Reflow Phase
Liquidus Temperature
Time over Liquidus Temperature
Peak Temperature
Time within 5°C of actual Peak
Temperature
Cooling Phase
Ramp-down rate
sMIN
All temperatures refer to the top side of the package, measured on the package body surface.
to T
sMAX
Preheat
)
t
s
t
25° to Peak
T
T
t
T
T
t
t
T
s
L
p
sMIN
sMAX
25 ° to Peak
L
p
Time
Pb-Free Process
3 °C/sec max.
150°C
200°C
60 – 180 sec
8 min max.
217°C
60 – 150 sec
260°C
20 – 40 sec
6°C/sec max.
t
Reflow
L
t
p
Datasheet AX50424
Cooling

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