k4h560838h Samsung Semiconductor, Inc., k4h560838h Datasheet - Page 17

• Manufacturer Part Number: k4h560838h
• Description: 256mb H-die Ddr Sdram
• Manufacturer: Samsung Semiconductor, Inc.

The following specification parameters are required in systems using DDR333, DDR266 & DDR200 devices to ensure proper system
performance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
20.0 System Characteristics for DDR SDRAM
PARAMETER
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
K4H560438H
K4H560838H
K4H561638H
Slew Rate Characteristic
Slew Rate Characteristic
Input Slew Rate
Input Slew Rate
Delta Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
AC CHARACTERISTICS
AC CHARACTERISTICS
+100
∆tDS
+150
∆tDS
+100
∆tIS
+50
+75
+50
0
0
0
Typical Range
Typical Range
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
∆tDH
∆tDH
+150
+100
∆tIH
+75
+50
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
SYMBOL
DCSLEW
MIN
0.67
DDR400
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
1.5
MIN
(V/ns)
(V/ns)
0.5
4.5
4.5
5.0
5.0
DDR400
Notes
Notes
Notes
0.67
MIN
MAX
4.0
k
k
k
i
i
i
j
j
j
DDR333
a,c,d,f,g,h
b,c,d,f,g,h
a,c,d,f,g,h
b,c,d,f,g,h
Notes
Notes
MAX
1.5
MIN
0.5
DDR333
0.67
MIN
MAX
4.0
DDR266
Rev. 1.1 January 2006
MAX
1.5
MIN
0.5
DDR266
MAX
4.0
DDR SDRAM
Notes
e, l
Units
V/ns
Notes
a, l