ml2216 Oki Semiconductor, ml2216 Datasheet - Page 46
ml2216
Manufacturer Part Number
ml2216
Description
Oki Adpcm2 Algorithm-based Speech Synthesis Lsi
Manufacturer
Oki Semiconductor
Datasheet
1.ML2216.pdf
(48 pages)
- Current page: 46 of 48
- Download datasheet (634Kb)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
OKI Semiconductor
5
QFP44-P-910-0.80-2K
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.41 TYP.
4/Nov. 28, 1996
ML2216/ML22P16
FEDL2216FULL-03
(Unit: mm)
46/48
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