ncs5000 ON Semiconductor, ncs5000 Datasheet - Page 5

• Manufacturer Part Number: ncs5000
• Description: Integrated Rf Schottky Detector
• Manufacturer: ON Semiconductor

total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T
temperature of the die, R
the device junction to ambient, and the operating
temperature, T
sheet for the TSOP–6 package, P
follows:
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Surface mount board layout is a critical portion of the
The power dissipation of the TSOP–6 is a function of the
The melting temperature of solder is higher than the rated
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100 C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10 C.
INFORMATION FOR USING THE TSOP–6 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
A
. Using the values provided on the data
J(max)
P
D
=
, the maximum rated junction
T
JA
J(max)
, the thermal resistance from
R
JA
– T
D
A
can be calculated as
TSOP–6 POWER DISSIPATION
SOLDERING PRECAUTIONS
http://onsemi.com
TSOP–6
NCS5000
5
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
one can calculate the power dissipation of the device which
in this case is 400 milliwatts.
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 417
milliwatts.
*Soldering a device without preheating can cause excessive thermal
shock and stress which can result in damage to the device.
The values for the equation are found in the maximum
The 300 C/W for the TSOP–6 package assumes the use
The soldering temperature and time should not exceed
260 C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5 C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling.
P
D
= 150 C – 25 C = 417 milliwatts
300 C/W
A
of 25 C,