saa-cic61508-osrf5v Infineon Technologies Corporation, saa-cic61508-osrf5v Datasheet - Page 26

• Manufacturer Part Number: saa-cic61508-osrf5v
• Description: Functional Safety Companion Chip
• Manufacturer: Infineon Technologies Corporation

3
Chapter 3
3.1
Table 3
Table 3
Parameter
PG-TSSOP-38
Thermal resistance junction
case
Thermal resistance junction
lead
1) The thermal resistances between the case and the ambient (
Data Sheet
combined with the thermal resistances between the junction and the case (
(
(
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
the total thermal resistance between the junction and the ambient, while
max.
partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
R
R
1)
TJL
TJA
1)
) given above, in order to calculate the total thermal resistance between the junction and the ambient
). The thermal resistances between the case and the ambient (
V
provides the thermal characteristics of the package used in CIC61508.
DDP
provides the information of the CIC61508 package and reliability section.
Package and Quality Declaration
Package Parameters
and max.
Thermal Characteristics of the Package
I
DDP
. The total junction ambient resistance
Symbol
R
R
TJC
TJL
CC -
CC -
Min.
21
Limit Values
R
TCA
Package and Quality Declaration
) , the lead and the ambient (
Max.
15.7
39.2
R
TJA
R
TCA
can be obtained from the upper four
P
D
T
), the lead and the ambient (
is given by the multiplication of the
J
=
R
T
TJC
A
+
R
Unit
K/W
K/W
), the junction and the lead
TJA
×
P
D
, where the
Notes
-
-
V1.0, 2011-03
CIC61508
R
TLA
) are to be
R
R
TJA
TLA
is
)