lh28f640 Sharp Microelectronics of the Americas, lh28f640 Datasheet

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lh28f640

Manufacturer Part Number
lh28f640
Description
64m X16 Flash Memory
Manufacturer
Sharp Microelectronics of the Americas
Datasheet

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Date
Nov. 16. 2001
64M (x16) Flash Memory
LH28F640BFN-PTTLZ2

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lh28f640 Summary of contents

Page 1

... Flash Memory LH28F640BFN-PTTLZ2 Date Nov. 16. 2001 ...

Page 2

Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. When using the products covered herein, please observe ...

Page 3

... SOP Pinout ................................................... 3 Pin Descriptions.......................................................... 4 Memory Map .............................................................. 5 Identifier Codes and OTP Address for Read Operation ............................................. 6 OTP Block Address Map for OTP Program............... 7 Bus Operation............................................................. 8 Command Definitions ................................................ 9 Functions of Block Lock and Block Lock-Down...... 11 Block Locking State Transitions upon Command Write................................................. 11 Status Register Definition......................................... 12 Extended Status Register Definition ...

Page 4

... Fast program capability is provided through the use of high speed Page Buffer Program. Special OTP (One Time Program) block provides an area to store permanent code such as a unique number. * ETOX is a trademark of Intel Corporation. LHF64FZ2 LH28F640BFN-PTTLZ2 64Mbit (4Mbit 16) Page Mode Flash MEMORY Enhanced Data Protection Features • ...

Page 5

LHF64FZ2 44-LEAD SOP STANDARD PINOUT CE# 12 ...

Page 6

... ADDRESS INPUTS: Inputs for addresses. 64M: A INPUT 0 21 DATA INPUTS/OUTPUTS: Inputs data and commands during CUI (Command User INPUT/ Interface) write cycles, outputs data during memory array, status register, query code and DQ - OUTPUT identifier code reads. Data pins float to high-impedance (High Z) when the chip or outputs are deselected. Data is internally latched during an erase or program cycle. CHIP ENABLE: Activates the device’ ...

Page 7

... Figure 2. Memory Map (Top Parameter) LHF64FZ2 BLOCK NUMBER ADDRESS RANGE 63 32K-WORD 62 32K-WORD 61 32K-WORD 60 32K-WORD 59 32K-WORD 58 32K-WORD 57 32K-WORD 56 32K-WORD 55 32K-WORD 54 ...

Page 8

Table 2. Identifier Codes and OTP Address for Read Operation Manufacturer Code Manufacturer Code Device Code Top Parameter Device Code Block Lock Configuration Block is Unlocked Code Block is Locked Block is not Locked-Down Block is Locked-Down OTP OTP Lock ...

Page 9

LHF64FZ2 [ 000088H Customer Programmable Area 000085H 000084H Factory Programmed Area 000081H Reserved for Future Implementation 000080H (DQ -DQ 15 Customer Programmable Area Lock Bit (DQ Factory Programmed Area Lock Bit (DQ Figure 3. OTP Block ...

Page 10

... Command writes involving block erase, full chip erase, (page buffer) program or OTP program are reliably executed when V =2.7V-3.6V Refer to Table 4 for valid D during a write operation Never hold OE# low and WE# low at the same timing. 7. Refer to Appendix of LH28F640BF series for more information about query code. LHF64FZ2 (1, 2) CE# OE# WE# Address V ...

Page 11

... OA=Address of OTP block to be read or programmed (See Figure 3). 3. ID=Data read from identifier codes. (See Table 2). QD=Data read from query database. Refer to Appendix of LH28F640BF series for details. SRD=Data read from status register. See Table 7 and Table 8 for a description of the status register bits. ...

Page 12

Following the Clear Block Lock Bit command, the selected block is unlocked regardless of lock-down configuration. 10. Commands other than those shown above are reserved by SHARP for future device implementations ...

Page 13

Table 5. Functions of Block Lock Current State (1) (1) State [00 (3) [01] [10 [11 NOTES =1: a block is locked; DQ =0: a block ...

Page 14

WSMS BESS BEFCES 7 6 SR.15 - SR.8 = RESERVED FOR FUTURE ENHANCEMENTS (R) SR.7 = WRITE STATE MACHINE STATUS (WSMS Ready 0 = Busy SR.6 = BLOCK ERASE SUSPEND STATUS (BESS ...

Page 15

SMS XSR.15-8 = RESERVED FOR FUTURE ENHANCEMENTS (R) XSR.7 = STATE MACHINE STATUS (SMS Page Buffer Program available 0 = Page Buffer Program not available XSR.6-0 = RESERVED FOR FUTURE ENHANCEMENTS ...

Page 16

Electrical Specifications 1.1 Absolute Maximum Ratings Operating Temperature During Read, Erase and Program ...... +70 C Storage Temperature During under Bias............................... - +80 C During non Bias................................ - +125 C Voltage On ...

Page 17

Capacitance ( f=1MHz) A Parameter Symbol Input Capacitance RST# Input Capacitance Output Capacitance NOTE: 1. Sampled, not 100% tested. 1.2.2 AC Input/Output Test Conditions V CC INPUT 0.0 AC test inputs are driven at V ...

Page 18

DC Characteristics Symbol Parameter I Input Load Current LI I Output Leakage Current Standby Current CCS Automatic Power Savings Current CCAS Reset Power-Down Current CCD CC Average V Read CC ...

Page 19

AC Characteristics - Read-Only Operations Symbol t Read Cycle Time AVAV t Address to Output Delay AVQV t CE# to Output Delay ELQV t Page Address Access Time APA t OE# to Output Delay GLQV t RST# High to ...

Page 20

(A) (A) 21-0 20 (E) CE OE# ( (W) WE (D/Q) 15 (P) RST# V ...

Page 21

(A) (A) 21-3 20 (A) 2 CE# ( OE# ( WE# ( High ...

Page 22

AC Characteristics - Write Operations Symbol t Write Cycle Time AVAV RST# High Recovery to WE# (CE#) Going Low PHWL PHEL CE# (WE#) Setup to WE# (CE#) Going Low ELWL WLEL t (t ...

Page 23

NOTE (A) (A) 21-0 20 (E) CE ELWL WLEL V IH OE# ( PHWL PHEL V IH WE# ( ...

Page 24

Reset Operations V IH RST# ( High (D/Q) 15 RST# ( High (D/Q) 15 (min GND V ...

Page 25

Block Erase, Full Chip Erase, (Page Buffer) Program and OTP Program Performance Symbol Parameter 4K-Word Parameter Block t WPB Program Time 32K-Word Main Block t WMB Program Time t / WHQV1 Word Program Time t EHQV1 t / WHOV1 ...

Page 26

... Related Document Information Document No. FUM00701 NOTE: 1. International customers should contact their local SHARP or distribution sales offices. LHF64FZ2 (1) Document Name LH28F640BF series Appendix 24 Rev. 2.41 ...

Page 27

A-1 RECOMMENDED OPERATING CONDITIONS A-1.1 At Device Power-Up AC timing illustrated in Figure A-1 is recommended for the supply voltages and the control signals at device power-up. If the timing in the figure is ignored, the device may not operate ...

Page 28

A-1.1.1 Rise and Fall Time Symbol t V Rise Time Input Signal Rise Time R t Input Signal Fall Time F NOTES: 1. Sampled, not 100% tested. 2. This specification is applied for not only the device ...

Page 29

A-1.2 Glitch Noises Do not input the glitch noises which are below V as shown in Figure A-2 (b). The acceptable glitch noises are illustrated in Figure A-2 (a). Input Signal V (Min (Max.) IL Input Signal (a) ...

Page 30

... A-2 RELATED DOCUMENT INFORMATION Document No. AP-001-SD-E AP-006-PT-E AP-007-SW-E NOTE: 1. International customers should contact their local SHARP or distribution sales office. (1) Document Name Flash Memory Family Software Drivers Data Protection Method of SHARP Flash Memory RP#, V Electric Potential Switching Circuit PP iv Rev. 1.10 ...

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