w25q32bv Winbond Electronics Corp America, w25q32bv Datasheet - Page 68

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w25q32bv

Manufacturer Part Number
w25q32bv
Description
32m-bit Serial Flash Memory With Dual And Quad Spi
Manufacturer
Winbond Electronics Corp America
Datasheet

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8-Contact 6x5mm WSON Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
placement of exposed PCB vias under the pad.
SYMBOL
SOLDER PATTERN
M
N
Q
R
P
MIN
MILLIMETERS
TYP.
3.40
4.30
6.00
0.50
0.75
- 68 -
MAX
MIN
INCHES
0.1338
0.1692
0.2360
0.0196
0.0255
TYP.
MAX
W25Q32BV

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