ncs2300 ON Semiconductor, ncs2300 Datasheet - Page 11

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ncs2300

Manufacturer Part Number
ncs2300
Description
Low Power Comparators
Manufacturer
ON Semiconductor
Datasheet

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total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
Surface mount board layout is a critical portion of the
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
0.074
0.074
1.9
1.9
0.037
0.037
0.95
0.037
0.95
0.037
0.95
0.95
http://onsemi.com
SOT23−6
SOT23−5
0.094
0.094
11
2.4
2.4
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.039
0.039
1.0
1.0
inches
inches
0.028
mm
0.028
mm
0.7
0.7

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