pef4265 Infineon Technologies Corporation, pef4265 Datasheet - Page 36

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pef4265

Manufacturer Part Number
pef4265
Description
Subscriber Line Interface Circuit Enhanced Feature Set
Manufacturer
Infineon Technologies Corporation
Datasheet

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6.2
Figure 24
Note: Dimensions in mm
Attention: The exposed die pad and the die pad edges are connected to VBATH via the chip substrate. Due
6.2.1
For detailed information on PCB related thermal and soldering issues of the PG-VQFN-48-48 package see [3],
chapter 3 and 4.
Preliminary Data Sheet
Index Marking
to the high voltage of up to 150 V between VHR and VBATH, touching of the die pad or any
attached conducting part can be hazardous.
PG-VQFN-48-48 Package
Package Outline for PG-VQFN-48-48 (Plastic Green Very thin Profile Quad Flatpack No-lead)
Recommended PCB Foot Print Pattern for PG-VQFN-48-48 Package
7
6.8
±0.1
0.4 x 45˚
A
B
48x
+0.03
0.08
C
0.05 MAX.
(0.2)
(0.65)
0.9 MAX.
36
24
13
12
25
11 x 0.5 = 5.5
0.23
(5.2)
(6.2)
0.5
±0.05
PEF 4265 / PEF 4365
1
36
Revision 2.2, 2008-02-06
48x
37
48
SLIC-E / TSLIC-E
Index Marking
0.1
Package Outlines
M
GVQ01236
A
B
C

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