pef4265 Infineon Technologies Corporation, pef4265 Datasheet - Page 3

• Manufacturer Part Number: pef4265
• Description: Subscriber Line Interface Circuit Enhanced Feature Set
• Manufacturer: Infineon Technologies Corporation

SLIC-E / TSLIC-E Subscriber Line Interface Circuit Enhanced Feature Set
Revision History: 2008-02-06, Revision 2.2
Previous Version: Revision 2.1
Page
21
36
Trademarks of Infineon Technologies AG:
ABM™, A-GOLD™, AOP™, BlueMoon™, ConverGate™, Converpath™, COSIC™, C166™, DUALFALC™,
DuSLIC™, E-GOLD™, ELASTec™, Epic™, FALC™, FlexiSLIC™, GEMINAX™, GIGAFLOW™, GOLDMOS™,
INCA™, IOM™, IPVD™, Isac™, IWE™, IWORX™, LEDFET™, M-GOLD™, MuSLIC™, OCTALFALC™,
OCTAT™, OmniTune™, OmniVia™, OPTIVERSE™, PASi™, PROSOC™, QUADFALC™, SCEPTRE™,
SCOUT™, SEROCCO™, S-GOLD™, SICOFI™, SIEGET™, SLIC™, SMARTI™, SMARTiPM™, SMARTiPM+™,
SMARTiUE™, SMARTi3G™, SMARTi3G+™, SMINT™, SOCRATES™, TrueNTRY™, VINAX™, VINETIC™,
VIONTIC™, VOIPRO™, WDCT™, WildPass™, X-GOLD™, XMM™, X-PMU™.
Other trademarks: Microsoft
FrameMaker
PrimeCell
Embedded Trace Macrocell™ (ETM), Thumb
ARM926EJ-S™ of ARM Limited. OakDSPCore
IndoorGPS™, GL-20000™, GL-LN-22™ of Global Locate. mipi™ of MIPI Alliance. CAT-iq™ of DECT Forum.
MIPS™, MIPS II™, 24KEc™ of MIPS Technologies, Inc. Texas Instruments
VLYNQ™, Telogy Software™, TMS320C62x™, Code Composer Studio™, SSI™ of Texas Instruments
Incorporated. Luxworks
Association. Java™, SunOS™, Solaris™ of Sun Microsystems, Inc. Philips
Electronics N.V. Epson
Panasonic
of Taiyo Yuden Co., Ltd. TDK
Semiconductor
Electronics Engineers, Inc. Samsung
Corporation. Dallas Semiconductor
ISO
EMV™ of EMVCo, LLC. Zetex
Research, Inc. Verilog
WindRiver
Preliminary Data Sheet
®
of the International Organization for Standardization. IEC™ of the International Engineering Consortium.
®
®
®
, RealView
and VxWorks
Subjects (major changes since last revision)
“Absolute Maximum Ratings” on Page
“PG-VQFN-48-48 Package” on Page
PG-VQFN-48-48
of Matsushita Electric Industrial Co., Ltd. Murata
®
®
of Adobe Systems Incorporated. APOXI
, MICROWIRE™ of National Semiconductor Corporation. IEEE
®
®
, ARM
of Cadence Design Systems, Inc. ANSI
®
®
®
of Seiko Epson Corporation. Seiko
of LSI Corporation. Bluetooth
of Wind River Systems, Inc. Nucleus™ of Mentor Graphics Corporation.
®
, ARM
®
®
®
, Visio
of Zetex Semiconductors. Rohm™ of Rohm Co., Ltd. Microtec
of TDK Electronics Company, Ltd. Motorola
®
, 1-Wire
®
®
, OneNAND
Developer Suite™ (ADS), Multi-ICE™, ARM1176JZ-S™, CoreSight™,
®
, Windows
®
of Dallas Semiconductor Corp. NOVeA™ of Virage Logic Corp.
®
, ETM9™, AMBA™, ARM7™, ARM9™, ARM7TDMI-S™,
36: package changed from PG-VQFN-48-15 to
®
®
, TeakLite
, UtRAM
®
21: ESD SDM max. value changed from 1 kV to 500 V
3
of Microsoft Corporation. Linux
®
®
of Bluetooth SIG, Inc. IrDA
, COMNEON™ of Comneon GmbH & Co. OHG.
®
of Murata Manufacturing Company. Taiyo Yuden™
®
®
®
®
of the American National Standards Institute, Inc.
of Kabushiki Kaisha Hattori Seiko Corporation.
of Samsung Corporation. Toshiba
DSP Core, OCEM
®
®
, PowerPAD™, C62x™, C55x™,
, I2C-Bus
®
of The Institute of Electrical and
®
of Motorola, Inc. National
PEF 4265 / PEF 4365
Revision 2.2, 2008-02-06
®
®
®
®
SLIC-E / TSLIC-E
of ParthusCeva Inc.
of the Infrared Data
of Koninklijke Philips
of Linus Torvalds.
®
®
of Microtec
of Toshiba