adg5409 Analog Devices, Inc., adg5409 Datasheet - Page 21

• Manufacturer Part Number: adg5409
• Description: High Voltage Latch-up Proof, 4-/8-channel Multiplexers Adg5408/adg5409
• Manufacturer: Analog Devices, Inc.

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG5408BRUZ
ADG5408BRUZ-REEL7
ADG5408BCPZ-REEL7
ADG5409BRUZ
ADG5409BRUZ-REEL7
ADG5409BCPZ-REEL7
1
Z = RoHS Compliant Part.
1
INDICATOR
SEATING
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PLANE
0.80
0.75
0.70
PIN 1
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 38. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 37. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
TOP VIEW
16
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
4.10
4.00 SQ
3.90
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
4 mm × 4 mm Body, Very Very Thin Quad
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9
8
Rev. 0 | Page 21 of 24
1.20
MAX
0.20 REF
SEATING
PLANE
6.40
BSC
0.45
0.40
0.35
(CP-16-17)
BSC
0.65
0.05 MAX
0.02 NOM
(RU-16)
COPLANARITY
0.20
0.09
0.08
12
9
0.35
0.30
0.25
13
8
BOTTOM VIEW
EXPOSED
8°
0°
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
16
5
1
4
0.25 MIN
2.70
2.60 SQ
2.50
0.75
0.60
0.45
ADG5408/ADG5409
Package Option
RU-16
RU-16
CP-16-17
RU-16
RU-16
CP-16-17