adv7390 Analog Devices, Inc., adv7390 Datasheet - Page 15
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adv7390
Manufacturer Part Number
adv7390
Description
Low Power, Chip Scale 10-bit Sd/hd Video Encoder
Manufacturer
Analog Devices, Inc.
Datasheet
1.ADV7390.pdf
(96 pages)
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ABSOLUTE MAXIMUM RATINGS
Table 10.
Parameter
V
V
PV
V
V
V
V
AGND to DGND
AGND to PGND
AGND to GND_IO
DGND to PGND
DGND to GND_IO
PGND to GND_IO
Digital Input Voltage to GND_IO
Analog Outputs to AGND
Storage Temperature Range (t
Junction Temperature (t
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Analog output short circuit to any power supply or common can be of an
indefinite duration.
AA
DD
DD_IO
AA
DD
DD_IO
DD
to AGND
to V
to DGND
to PV
to PGND
to GND_IO
to V
DD
DD
DD
1
J
)
S
)
Rating
−0.3 V to +3.9 V
−0.3 V to +2.3 V
−0.3 V to +2.3 V
−0.3 V to +3.9 V
−0.3 V to +2.2 V
−0.3 V to +0.3 V
−0.3 V to +2.2 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to V
−0.3 V to V
−60°C to +100°C
150°C
260°C
DD_IO
AA
+ 0.3 V
Rev. 0 | Page 15 of 96
THERMAL RESISTANCE
soldered in a circuit board for surface-mount packages.
Table 11. Thermal Resistance
Package Type
32-Lead LFCP
40-Lead LFCSP
1
2
The ADV739x is a Pb-free product. The lead finish is 100% pure
Sn electroplate. The device is RoHS compliant, suitable for Pb-
free applications up to 255°C (±5°C) IR reflow (JEDEC STD-20).
The ADV739x is backward-compatible with conventional SnPb
soldering processes. The electroplated Sn coating can be
soldered with SnPb solder pastes at conventional reflow
temperatures of 220°C to 235°C.
ESD CAUTION
θ
Values are based on a JEDEC 4 layer test board.
With the exposed metal paddle on the underside of the LFCSP soldered to
the PCB ground.
JA
ADV7390/ADV7391/ADV7392/ADV7393
is specified for the worst-case conditions, that is, a device
1
θ
27
26
JA
2
θ
32
32
JC
Unit
°C/W
°C/W