CRG03 TOSHIBA Semiconductor CORPORATION, CRG03 Datasheet
CRG03
Manufacturer Part Number
CRG03
Description
General Purpose Rectifier Applications
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.CRG03.pdf
(4 pages)
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General Purpose Rectifier Applications
•
•
•
Absolute Maximum Ratings
Electrical Characteristics
Average forward current: I
Repetitive peak reverse voltage: V
Suitable for compact assembly due to small surface-mount package
“S−FLAT
Repetitive Peak Reverse Voltage
Average Forward Current
Peak One Cycle Surge Forward
Current (Non−Repetitive)
Junction Temperature
Storage Temperature Range
Note: 1 Ta = 56°C
Note 2: Using continuously under heavy loads (e.g. the application of
Peak forward voltage
Repetitive peak reverse current
Thermal resistance
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm × 2 mm
board thickness 0.64t
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
TM
Characteristics
Characteristics
” (Toshiba package name)
F (AV)
TOSHIBA Rectifier Silicon Diffused Type
(Ta = 25°C)
= 1.0 A
RRM
(Ta = 25°C)
Symbol
Symbol
R
V
V
V
R
I
V
F (AV)
I
I
T
th (j-a)
FSM
FM(1)
FM(2)
FM(3)
RRM
th (j-ℓ)
RRM
T
= 400 V
stg
j
CRG03
I
I
I
V
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64t
Device mounted on a glass-epoxy
board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6t
FM
FM
FM
RRM
1.0（Note）
15.0 (50Hz)
16.5 (60Hz)
−40~150
−40~150
= 0.1 A (Pulse test)
= 0.7 A (Pulse test)
= 1.0 A (Pulse test)
Rating
400
= 400 V (Pulse test)
1
Test Condition
―
Unit
°C
°C
V
A
A
Weight: 0.013 g (typ.)
JEDEC
JEITA
TOSHIBA
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
0.86
0.97
1.0
⎯
⎯
⎯
⎯
3-2A1A
2006-11-06
―
―
Max
130
1.1
10
65
20
⎯
⎯
CRG03
Unit: mm
°C/W
°C/W
Unit
μA
V
V
V
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CRG03 Summary of contents
Page 1
... °C °C JEDEC ― JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) Min Typ. Max ⎯ 0.86 ⎯ 0.97 ⎯ 1.0 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 130 ⎯ ⎯ 2006-11-06 CRG03 Unit: mm Unit ⎯ V 1.1 V ⎯ V μ °C/W 20 °C/W ...
Page 2
... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. Unit CRG03 2006-11-06 ...
Page 3
... Board thickness 1.2 10000 (1) Device mounted on a ceramic board: Soldering land × (2) Device mounted on a glass-epoxy board: Soldering land × 1000 100 10 1 100 0.001 0.01 3 CRG03 P – (AV) F (AV) 0.4 0.6 0.8 1.0 1.2 (A) F (AV) Device mounted on a glass-epoxy board □ □ ...
Page 4
... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CRG03 20070701-EN 2006-11-06 ...