CM150DX-24S Powerex Inc, CM150DX-24S Datasheet - Page 4

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CM150DX-24S

Manufacturer Part Number
CM150DX-24S
Description
Manufacturer
Powerex Inc
Type
IGBT Moduler
Datasheet

Specifications of CM150DX-24S

Prx Availability
RequestQuote
Voltage
1200V
Current
150A
Circuit Configuration
Dual
Rohs Compliant
Yes
Recommended Gate Driver
VLA504-01
Recommended Dc To Dc Converter
VLA106-15242
Interface Circuit Ref Design
VLA536-01R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CM150DX-24S
Manufacturer:
MIT
Quantity:
20 000
4
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
CM150DX-24S
Dual IGBTMOD™ NX-S Series Module
150 Amperes/1200 Volts
Electrical Characteristics, T
NTC Thermistor Part
Characteristics
Zero Power Resistance
Deviation of Resistance
B Constant
Power Dissipation
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance,
Case to Heatsink
Mechanical Characteristics
Mounting Torque
Creepage Distance
Clearance
Weight
Flatness of Baseplate
Recommended Operating Conditons, T
(DC) Supply Voltage
Gate (-Emitter Drive) Voltage
External Gate Resistance
*2 Case temperature (T
*6 B
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
R
R
(25/50)
25
50
; Resistance at Absolute Temperature T
; Resistance at Absolute Temperature T
= In(
R
R
50
25
)/(
*2
T
C
25
1
) and heatsink temperature (T
MOUNTING SIDE
T
50
1
MOUNTING SIDE
)
25
50
j
[K]; T
[K]; T
= 25°C unless otherwise specified (continued)
*2
*2
25
50
s
) is measured on the surface
= 25 [°C] + 273.15 = 298.15 [K]
= 50 [°C] + 273.15 = 323.15 [K]
X
MOUNTING
R
R
B
V
Symbol
R
∆R/R
th(j-c)
th(j-c)
GE(on)
(25/50)
V
Y
R
P
th(c-f)
SIDE
M
R
M
d
d
e
m
CC
25
25
+ : CONVEX
s
a
c
G
s
– : CONCAVE
t
a
Q
D
= 25°C
Mounting to Heatsink, M5 Screw
Applied Across G1-Es1 / G2-Es2
Approximate by Equation
T
C
Main Terminals, M6 Screw
Thermal Grease Applied
= 100°C, R
Per Inverter FWDi
Per Inverter IGBT
Terminal to Baseplate
Terminal to Baseplate
Applied Across C1-E2
Terminal to Terminal
Terminal to Terminal
On Centerline X, Y
Test Conditions
(Per 1 Module)
T
T
C
C
Per Switch
= 25°C
= 25°C
100
29.1
38.1
0
*2
*2
= 493Ω
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
*7
*8
*6
47
48
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
1
2
Di2
3
4 5
Th
Tr2
12.32
10.00
10.85
6
11.55
Min.
4.85
13.5
-7.3
7
31
22
±0
0
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22
0.015
Di1
3375
Tr1
5.00
15.0
Typ.
350
600
35
27
24
23
±100
Max.
5.15
0.13
0.23
16.5
+7.8
850
40
31
30
LABEL SIDE
10
12/11 Rev. 3
Grams
Units
Volts
Volts
mW
K/W
K/W
K/W
in-lb
in-lb
mm
mm
mm
mm
0
µm
kΩ
29.0
40.8
%
K

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