LPC2470 NXP Semiconductors, LPC2470 Datasheet - Page 87

• Manufacturer Part Number: LPC2470
• Description: NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 26.
LPC2470
Product data sheet
Document ID
LPC2470 v.3
Modifications:
LPC2470 v.2
Modifications:
LPC2470 v.1
Revision history
Release date
20110214
20091015
20081027
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…continued
Changed data sheet status to Product data sheet.
Table 4 “Pin description”: Added Table note 14 for XTAL1 and XTAL2 pins.
Table 4 “Pin description”: Added Table note 15 for RTCX1 and RTCX2 pins.
Table 4 “Pin description”: Added Table note 16 for DBGEN, TMS, TDI, TRST, and RTCK
pins.
Table 4 “Pin description”: Added Table note 17 for TCK and TDO pins.
Table 8 “Static characteristics”: Removed R
Table 8 “Static characteristics”: Added Table note 3 to I
I
Table 8 “Static characteristics”: Changed V
Added Table 10 “Dynamic characteristic: internal oscillators”.
Added Table 11 “Dynamic characteristic: I/O pins[1]”.
Table 13 “Dynamic characteristics: Static external memory interface”: Updated min, typical
and max values for t
Table 14 “Dynamic characteristics: Dynamic external memory interface”: Added Table
note 1.
Table 14 “Dynamic characteristics: Dynamic external memory interface”: Updated text
under caption.
Added Table 16 “DAC electrical characteristics”.
Added Section 9 “Thermal characteristics”.
Added Section 10.3 “Electrical pin characteristics”
Added Section 14.4 “Crystal oscillator XTAL input and component selection”.
Added Section 14.5 “RTC 32 kHz oscillator component selection”.
Added Section 14.7 “Standard I/O pin configuration”
Added Section 14.8 “Reset pin configuration”
Moved Figure 13 “External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)”
to below Table 9 “Dynamic characteristics”.
Updated Figure 19 “ADC characteristics”.
Table 6: Changed ESD min/max to 2500/+2500.
Table 8: Updated conditions and typical values for I
Table 8: Updated Table note 13.
Table 8: Updated min, typical and max values for oscillator pins.
Added deep power-down mode information.
Added Section 11.3 “XTAL1 input”.
Figure 23: Changed ISP1301 to ISP1302.
Figure 24: Changed ISP1301 to ISP1302.
Section 7.26.3 “Brownout detection”: Changed V
BAT
.
All information provided in this document is subject to legal disclaimers.
Data sheet status
Product data sheet
Preliminary data sheet
Preliminary data sheet
Rev. 4 — 8 September 2011
h(D)
.
hys
pu
Change notice
-
-
-
.
typ for I
Flashless 16-bit/32-bit microcontroller
DD(3V3)
DD(DCDC)act(3V3)
2
DD(DCDC)pd(3V3)
C-bus pins from 0.5V
to V
DD(DCDC)(3V3)
Supersedes
LPC2470 v.2
LPC2470 v.1
-
.
, I
DD(DCDC)dpd(3V3)
LPC2470
© NXP B.V. 2011. All rights reserved.
.
DD
to 0.05V
87 of 91
, and
DD
.