PXAH40KFBE NXP Semiconductors, PXAH40KFBE Datasheet - Page 20

PXAH40KFBE

Manufacturer Part Number
PXAH40KFBE
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PXAH40KFBE

Cpu Family
XA
Device Core
80C51
Device Core Size
16b
Frequency (max)
30MHz
Interface Type
USART
Program Memory Type
ROMLess
Program Memory Size
Not Required
# I/os (max)
32
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.97V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / Rohs Status
Compliant

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Philips Semiconductors
memory bank or peripheral can be programmed to accommodate
slow or fast devices.
Each memory bank and its associated RAS (chip select in DRAM
mode) output, can be programmed to access up to an 8 MB
mappable address space in either EDO or FPM DRAM modes (up
to a total of 32 MB of DRAM. WARNING: Future XA-H4 derivatives
may not support separate code and data spaces.)
Bus Interface Pins
For the following discussion, see Figure 3.
1999 Sep 24
WARNING: On the external bus, ALL XA-H4 reads are 16-bit Reads. If the CPU instruction only specifies 8-bits, then the CPU uses the appropriate
byte, and discards the extra byte. Thus “8-Bit Reads” and “16-Bit Reads” appear to be identical on the bus. On an 8-bit bus, this will appear
as two consecutive 8-bit reads even though the CPU instruction specified a byte read.
Some 8-bit I/O devices (especially FIFOs) cannot operate correctly with 2 bytes being read for a 1 Byte Read. The most common (and least
expensive) solution is to operate these 8-bit devices on a 16-bit bus, and access them in software on all odd byte (or all even byte) boundaries.
An added benefit of this technique is that byte Reads are faster than on an 8-bit bus, because only 1 word is fetched (a single Read) instead of
2 consecutive bytes.
Single-chip 16-bit microcontroller
DRAM Controller
SRAM Controller
Dynamic Bus Sizing
Progammable Bus Timing
Figure 3. Memory bus interface signal pins
Memory Interface
XA-H4
20
Each memory bank and associated chip select programmed for
“generic” (SRAM, Flash, ROM, peripheral chips, etc.) is capable of
supporting a 1 MB address space.
The Memory Interface can be programmed to support both Intel
style and 68000 bus style SRAMs and peripherals.
Chip Select Pins
There are six chip select pins (CS5 – CS0) mapped to six sets of bank
control registers. The following attributes are individually programmable
for each bank and associated chip select (or RAS, if DRAM): bank
on/off, address range, external device access time, detailed bus strobe
sequence, DRAM cycle or generic bus cycle, DRAM size if DRAM,
and bus width. Pin CS0 is always generic in order to service the boot
device, thus CS0 cannot be connected to DRAM.
CS5 or RAS5 (or P3.1, RTS1)
CS4 or RAS4 (or P3.0, RTClk1)
CS3 or RAS3
CS2 or RAS2
CS1 or RAS1
CS0
ClkOut
BHE or CASH
BLE or CASL
OE
WE
WAIT, SIZE16
D15–D0
A19–A0
(on DRAM cycle, A22 – A0
are Time-Multiplexed for RAS/CAS)
Preliminary specification
SU01274
XA-H4

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