DG409DVZ Intersil, DG409DVZ Datasheet - Page 15
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DG409DVZ
Manufacturer Part Number
DG409DVZ
Description
IC MULTIPLEXER DUAL 4X1 16TSSOP
Manufacturer
Intersil
Type
Analog Multiplexerr
Datasheet
1.DG408DJZ.pdf
(17 pages)
Specifications of DG409DVZ
Function
Multiplexer
Circuit
2 x 4:1
On-state Resistance
100 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
5 V ~ 34 V, ±5 V ~ 20 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP
Package
16TSSOP
Maximum On Resistance
100@±15V Ohm
Maximum Propagation Delay Bus To Bus
250@±15V@-40C to 85C|180(Typ)@12V ns
Maximum High Level Output Current
30 mA
Multiplexer Architecture
4:1
Maximum Turn-off Time
120(Typ)@12V ns
Maximum Turn-on Time
180(Typ)@12V ns
Power Supply Type
Single|Dual
Rohs Compliant
YES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DG409DVZ
Manufacturer:
Intersil
Quantity:
384
Company:
Part Number:
DG409DVZ
Manufacturer:
Intersil
Quantity:
416
Part Number:
DG409DVZ
Manufacturer:
VISHAY/威世
Quantity:
20 000
Part Number:
DG409DVZ-T
Manufacturer:
INTERSIL
Quantity:
20 000
N
1
Thin Shrink Small Outline Plastic Packages (TSSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E1” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
0.10(0.004)
2
-A-
INDEX
AREA
JEDEC MO-153-AB, Issue E.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
index feature must be located within the crosshatched area.
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
sions are not necessarily exact. (Angles in degrees)
3
e
b
0.05(0.002)
D
M
C A
SEATING PLANE
M
E1
-C-
-B-
B S
A
15
A1
E
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
0.25
M
B
M
L
DG408, DG409
c
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
E1
D
N
α
A
b
e
E
L
c
0.002
0.033
0.0075
0.0035
0.193
0.169
0.246
0.020
MIN
0
-
0.026 BSC
o
INCHES
16
0.006
MAX
0.043
0.037
0.012
0.008
0.201
0.177
0.256
0.028
8
o
0.05
0.85
0.19
0.09
4.90
4.30
6.25
0.50
MILLIMETERS
MIN
0
-
o
0.65 BSC
16
MAX
1.10
0.15
0.95
0.30
0.20
5.10
4.50
6.50
0.70
8
o
Rev. 1 2/02
June 13, 2006
NOTES
FN3283.8
9
3
4
6
7
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