LFXP6C-4TN144C Lattice, LFXP6C-4TN144C Datasheet - Page 9
LFXP6C-4TN144C
Manufacturer Part Number
LFXP6C-4TN144C
Description
IC FPGA 5.8KLUTS 100I/O 144-TQFP
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP6C-4TN144C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP6C-4TN144C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Company:
Part Number:
LFXP6C-4TN144C-3I
Manufacturer:
LATTICE
Quantity:
3 560
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Lattice Semiconductor
Board Timing Guidelines for the DDR SDRAM Controller IP Core
PCB Layout Recommendations for BGA Packages
Section III. LatticeXP Family Handbook Revision History
ispLEVER Controlled Place and Route.......................................................................................................... 17-10
Guided Map and PAR .................................................................................................................................... 17-14
Conclusion ..................................................................................................................................................... 17-15
Technical Support Assistance........................................................................................................................ 17-16
Introduction ...................................................................................................................................................... 18-1
Read Operation................................................................................................................................................ 18-2
Write Operation ................................................................................................................................................ 18-4
Address and Command Signals....................................................................................................................... 18-5
Board Design Guidelines ................................................................................................................................. 18-7
Technical Support Assistance.......................................................................................................................... 18-8
Appendix A. Example Extractions of Delays from Timing Reports .................................................................. 18-9
Introduction ...................................................................................................................................................... 19-1
BGA Breakout and Routing Examples ............................................................................................................. 19-1
PCB Fabrication Cost and Design Rule Considerations ................................................................................ 19-12
Advantages and Disadvantages of BGA Packaging ...................................................................................... 19-13
BGA Package Test and Assembly ................................................................................................................. 19-14
PCB Design Support ...................................................................................................................................... 19-17
Technical Support Assistance........................................................................................................................ 19-17
Revision History ............................................................................................................................................. 19-18
Revision History ............................................................................................................................................... 20-1
Running Multiple Routing Passes ......................................................................................................... 17-10
Using Multiple Placement Iterations (Cost Tables) ............................................................................... 17-11
Clock Boosting ...................................................................................................................................... 17-12
Notes on Guided Mapping .................................................................................................................... 17-15
Notes on Guided PAR........................................................................................................................... 17-15
Set-up Time Calculation for the Data Input (Max. Case) ........................................................................ 18-3
Hold Time Calculation for the Data Input (Min. Case)............................................................................. 18-3
Write Set-up ............................................................................................................................................ 18-4
Write Hold ............................................................................................................................................... 18-5
Set-up Calculation................................................................................................................................... 18-6
Hold Calculation ...................................................................................................................................... 18-7
64-ball csBGA BGA Breakout and Routing Example.............................................................................. 19-3
64-ball ucBGA BGA Breakout and Routing Example.............................................................................. 19-4
100-ball csBGA BGA Breakout and Routing Examples .......................................................................... 19-5
132-ball csBGA BGA Breakout Examples .............................................................................................. 19-7
144-ball csBGA BGA Breakout Examples .............................................................................................. 19-9
256-ball caBGA BGA Breakout Examples ............................................................................................ 19-11
8
LatticeXP Family Handbook
Table of Contents
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