ADG1308BRUZ Analog Devices Inc, ADG1308BRUZ Datasheet - Page 14
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ADG1308BRUZ
Manufacturer Part Number
ADG1308BRUZ
Description
IC MULTIPLEXER 8X1 16TSSOP
Manufacturer
Analog Devices Inc
Type
Analog Multiplexerr
Datasheet
1.ADG1308BRUZ-REEL7.pdf
(16 pages)
Specifications of ADG1308BRUZ
Function
Multiplexer
Circuit
1 x 8:1
On-state Resistance
210 Ohm
Current - Supply
1µA
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
No. Of Circuits
1
Supply Current
220µA
On State Resistance Max
130ohm
Supply Voltage Range
10.8V To 13.2V, ± 13.5V To ± 16.5V
Operating Temperature Range
-40°C To +105°C
Package
16TSSOP
Maximum On Resistance
500@10.8V Ohm
Maximum Propagation Delay Bus To Bus
130@±15V|170@12V ns
Maximum High Level Output Current
30 mA
Multiplexer Architecture
8:1
Maximum Turn-off Time
130@12V ns
Maximum Turn-on Time
110@12V ns
Power Supply Type
Single|Dual
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADG1308BRUZ
Manufacturer:
TI
Quantity:
116
Part Number:
ADG1308BRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
ADG1308BRUZ-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADG1308/ADG1309
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1308BRUZ
ADG1308BRUZ-REEL7
ADG1308BRZ
ADG1308BRZ-REEL7
ADG1309BRUZ
ADG1309BRUZ-REEL7
ADG1309BRZ
ADG1309BRZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
COPLANARITY
0.15
0.05
0.25 (0.0098)
0.10 (0.0039)
0.10
4.50
4.40
4.30
PIN 1
4.00 (0.1575)
3.80 (0.1496)
BSC
0.65
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
Figure 23. 16-Lead Thin Shrink Small Outline Package [TSSOP]
1
Figure 24. 16-Lead Standard Small Outline Package [SOIC_N]
COPLANARITY
16
1
COMPLIANT TO JEDEC STANDARDS MO-153-AB
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
10.00 (0.3937)
5.10
5.00
4.90
COMPLIANT TO JEDEC STANDARDS MS-012-AC
9.80 (0.3858)
0.10
Dimensions shown in millimeters and (inches)
BSC
0.30
0.19
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
9
8
1.20
MAX
Rev. A | Page 14 of 16
9
8
SEATING
PLANE
BSC
6.40
Narrow Body
6.20 (0.2441)
5.80 (0.2283)
(RU-16)
SEATING
PLANE
1.75 (0.0689)
1.35 (0.0531)
(R-16)
0.20
0.09
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.75
0.60
0.45
45°
Package Option
RU-16
RU-16
R-16
R-16
RU-16
RU-16
R-16
R-16