ADG709BRU Analog Devices Inc, ADG709BRU Datasheet - Page 20
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ADG709BRU
Manufacturer Part Number
ADG709BRU
Description
IC MULTIPLEXER DUAL 4X1 16TSSOP
Manufacturer
Analog Devices Inc
Type
Analog Multiplexerr
Datasheet
1.ADG709BRUZ-REEL7.pdf
(20 pages)
Specifications of ADG709BRU
Rohs Status
RoHS non-compliant
Function
Multiplexer
Circuit
2 x 4:1
On-state Resistance
4.5 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
1.8 V ~ 5.5 V, ±2.5 V
Current - Supply
0.001µA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Package
16TSSOP
Maximum On Resistance
11@3V Ohm
Maximum Propagation Delay Bus To Bus
14(Typ)@5V|18(Typ)@3V|14(Typ)@±2.5V ns
Maximum High Level Output Current
30 mA
Multiplexer Architecture
4:1
Number Of Channels Per Chip
1
Maximum Turn-off Time
8(Typ)@3V ns
Maximum Turn-on Time
18(Typ)@3V ns
Power Supply Type
Single|Dual
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADG709BRU
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
ADG709BRUZ
Manufacturer:
ADI
Quantity:
1 760
Part Number:
ADG709BRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
ADG709BRUZ-REEL7
Manufacturer:
NSC
Quantity:
48
ADG708/ADG709
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG708BRU
ADG708BRU-REEL
ADG708BRU-REEL7
ADG708BRUZ
ADG708BRUZ-REEL
ADG708BRUZ-REEL7
ADG708CRU
ADG708CRU-REEL
ADG708CRU-REEL7
ADG708CRUZ
ADG708CRUZ-REEL
ADG708CRUZ-REEL7
ADG709BRU
ADG709BRU-REEL
ADG709BRU-REEL7
ADG709BRUZ
ADG709BRUZ-REEL
ADG709BRUZ-REEL7
ADG709CRU
ADG709CRU-REEL
ADG709CRU-REEL7
ADG709CRUZ
ADG709CRUZ-REEL
ADG709CRUZ-REEL7
1
©2000–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
0.15
0.05
D00041-0-4/09(C)
4.50
4.40
4.30
PIN 1
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
0.30
0.19
9
8
Rev. C | Page 20 of 20
1.20
MAX
SEATING
PLANE
6.40
BSC
(RU-16)
0.20
0.09
8°
0°
0.75
0.60
0.45
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16