ADG1433YRUZ Analog Devices Inc, ADG1433YRUZ Datasheet - Page 17
ADG1433YRUZ
Manufacturer Part Number
ADG1433YRUZ
Description
IC SWITCH TRIPLE SPDT 16TSSOP
Manufacturer
Analog Devices Inc
Series
iCMOS®r
Datasheet
1.ADG1434YCPZ-REEL7.pdf
(20 pages)
Specifications of ADG1433YRUZ
Operating Temperature
-40°C ~ 125°C
Function
Switch
Circuit
3 x SPDT
On-state Resistance
4.7 Ohm
Voltage Supply Source
Dual, Single, Dual Supply
Voltage - Supply, Single/dual (±)
±5V, 12V, ±15V
Current - Supply
1µA
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Analogue Switch Type
SPDT
No. Of Channels
3
Bandwidth
200MHz
On State Resistance Max
4.7ohm
Turn Off Time
60ns
Turn On Time
140ns
Supply Voltage Range
± 4.5V To ± 16.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADG1433YRUZ
Manufacturer:
TDK
Quantity:
12 000
Part Number:
ADG1433YRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ORDERING GUIDE
Model
ADG1433YRUZ
ADG1433YRUZ-REEL
ADG1433YRUZ-REEL7
ADG1433YCPZ-REEL
ADG1433YCPZ-REEL7
ADG1434YRUZ
ADG1434YRUZ-REEL
ADG1434YRUZ-REEL7
ADG1434YCPZ-REEL
ADG1434YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
COPLANARITY
12° MAX
0.15
0.05
PIN 1
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 38. 20-Lead Thin Shrink Small Outline Package [TSSOP]
0.10
TOP VIEW
BSC SQ
4.00
20
0.80 MAX
0.65 TYP
1
BSC
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
0.65
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
6.60
6.50
6.40
Dimensions shown in millimeters
Dimensions shown in millimeters
1.20 MAX
BSC SQ
3.75
0.20 REF
Rev. C | Page 17 of 20
0.05 MAX
0.02 NOM
11
10
SEATING
PLANE
COPLANARITY
(CP-20-4)
0.60 MAX
(RU-20)
0.08
4.50
4.40
4.30
BSC
0.50
0.40
0.30
0.50
0.20
0.09
6.40 BSC
0.60 MAX
15
11
16
10
(BOTTOM VIEW)
EXPOSED
8°
0°
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PAD
20
6
1
5
2.65
2.50 SQ
2.35
0.25 MIN
0.75
0.60
0.45
ADG1433/ADG1434
EN Pin
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Package Option
RU-16
RU-16
RU-16
CP-16-13
CP-16-13
RU-20
RU-20
RU-20
CP-20-4
CP-20-4