PCA9673D,118 NXP Semiconductors, PCA9673D,118 Datasheet - Page 28
![IC I/O EXPANDER I2C 16B 24SOIC](/photos/6/52/65263/568-24-soic_sot137-1_sml.jpg)
PCA9673D,118
Manufacturer Part Number
PCA9673D,118
Description
IC I/O EXPANDER I2C 16B 24SOIC
Manufacturer
NXP Semiconductors
Datasheet
1.PCA9673PW112.pdf
(33 pages)
Specifications of PCA9673D,118
Interface
I²C
Number Of I /o
16
Interrupt Output
Yes
Frequency - Clock
1MHz
Voltage - Supply
2.3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-SOIC (7.5mm Width)
Includes
POR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4199-2
935283555118
PCA9673D-T
935283555118
PCA9673D-T
NXP Semiconductors
15. Handling information
16. Soldering
PCA9673_1
Product data sheet
16.1 Introduction to soldering
16.2 Wave and reflow soldering
16.3 Wave soldering
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Key characteristics in wave soldering are:
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Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
Remote 16-bit I/O expander for Fm+ I
Rev. 01 — 1 February 2007
2
C-bus with interrupt and reset
PCA9673
© NXP B.V. 2007. All rights reserved.
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