CGA6L1X7T2J104K TDK Corporation, CGA6L1X7T2J104K Datasheet - Page 34

• Manufacturer Part Number: CGA6L1X7T2J104K
• Description: CAP CER .10UF 630V X7T AUTO 1210
• Manufacturer: TDK Corporation
• Series: CGAr

Specifications of CGA6L1X7T2J104K

• Capacitance: 0.1µF
• Voltage - Rated: 630V
• Tolerance: ±10%
• Temperature Coefficient: X7T
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: Automotive
• Ratings: AEC-Q200
• Package / Case: 1210 (3225 Metric)
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height: -
• Thickness: 0.075" (1.90mm)
• Lead Spacing: -
• Features: -
• Lead Style: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 445-7116-2

• Recommended Soldering Land Pattern
TDK MLCC US Catalog
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Solder Amount
C
C
A
B
A
B
C
A
B
Type
Type
Type
Soldering
Information
C
B
0.35 - 0.45
[CC0603]
[CC0402]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
Chip capacitor
CGA3
CGA2
CGA5
A
[CC0805]
[CC0603]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
Unit: mm
CGA4
CGA3
CGA6
CGA Series – Automotive Grade Capacitors
Solder land
[CC1206]
[CC0805]
Solder resist
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
Unit: mm
Unit: mm
Maximum amount
Minimum amount
CGA5
CGA4
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Page 322
Peak
Temp
• Recommended Soldering Profile
300
0
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Manual
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
Wave Soldering
∆T
△T
Temp./
Manual soldering
Dura.
Preheating
Peak Temp time
(Solder iron)
Soldering
3sec. (As short as possible)
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
CGA2(CC0402), CGA3(CC0603),
CGA4(CC0805), CGA5(CC1206)
CGA6(CC1210)
CGA2(CC0402), CGA3(CC0603),
CGA4(CC0805), CGA5(CC1206)
CGA6(CC1210)
Peak temp
250 max.
260 max.
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
Duration
3 max.
5 max.
(sec.)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Version B11
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling