PIC32MX440F512H-80V/MR Microchip Technology, PIC32MX440F512H-80V/MR Datasheet - Page 213
![512 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 64 QFN 9x9x0.9mm TUBE](/photos/40/62/406286/landingpagemicrochippic32_sml.jpg)
PIC32MX440F512H-80V/MR
Manufacturer Part Number
PIC32MX440F512H-80V/MR
Description
512 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 64 QFN 9x9x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheet
1.TDGL001.pdf
(214 pages)
Specifications of PIC32MX440F512H-80V/MR
Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
512 KB
Data Ram Size
32 KB
Interface Type
USB, I2C, UART, RS-232, RS-485, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
5
Number Of Timers
5
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
QFN-64
Operating Temperature Range
- 40 C to + 105 C
Supply Current (max)
10 mA
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Eeprom Size
-
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Lead Free Status / Rohs Status
Details
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Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2011 Microchip Technology Inc.
Architecture
Product Groups
Flash Memory Family
Program Memory Size
Speed
Pin Count
Temperature Range
Package
Pattern
Flash Memory Family
Microchip Brand
Architecture
Product Groups
Flash Memory Family
Program Memory Size (KB)
Pin Count
Tape and Reel Flag (if applicable)
Speed
Temperature Range
Package
Pattern
MX = 32-bit RISC MCU core
3XX = General purpose microcontroller family
4XX = USB
F
32 = 32K
64 = 64K
128 = 128K
256 = 256K
512 = 512K
40 = 40 MHz
80 = 80 MHz
H
L
I
V
PT = 64-Lead (10x10x1 mm) TQFP (Thin Quad Flatpack)
PT = 100-Lead (12x12x1 mm) TQFP (Thin Quad Flatpack)
MR = 64-Lead (9x9x0.9 mm) QFN (Plastic Quad Flat)
BG = 121-Lead (10x10x1.1 mm) XBGA (Plastic Thin Profile Ball Grid Array)
Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise)
ES = Engineering Sample
PIC32 MX 3XX F 512 H T - 80 I / PT - XXX
= Flash program memory
= 64-pin
= 100-pin
= -40° C to +85° C (Industrial)
= -40° C to +105° C (V-Temp)
PIC32MX3XX/4XX
Examples:
PIC32MX320F032H-40I/PT:
General purpose PIC32MX,
32 KB program memory,
64-pin, Industrial temperature,
TQFP package.
PIC32MX360F256L-80I/PT:
General purpose PIC32MX,
256 KB program memory,
100-pin, Industrial temperature,
TQFP package.
.
DS61143H-page 213
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