PIC32MX440F512H-80V/MR Microchip Technology, PIC32MX440F512H-80V/MR Datasheet - Page 174
![512 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 64 QFN 9x9x0.9mm TUBE](/photos/40/62/406286/landingpagemicrochippic32_sml.jpg)
PIC32MX440F512H-80V/MR
Manufacturer Part Number
PIC32MX440F512H-80V/MR
Description
512 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 64 QFN 9x9x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheet
1.TDGL001.pdf
(214 pages)
Specifications of PIC32MX440F512H-80V/MR
Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
512 KB
Data Ram Size
32 KB
Interface Type
USB, I2C, UART, RS-232, RS-485, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
5
Number Of Timers
5
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
QFN-64
Operating Temperature Range
- 40 C to + 105 C
Supply Current (max)
10 mA
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Eeprom Size
-
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Lead Free Status / Rohs Status
Details
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PIC32MX3XX/4XX
FIGURE 29-13:
TABLE 29-31: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS61143H-page 174
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
SP60
Note 1:
Param.
No.
(CKP = 0)
(CKP = 1)
SDI
SDIx
SCKx
SDOx
SSx
SCKx
Note: Refer to
2:
3:
4:
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SC
SC
SC
SC
SC
SC
SC
SC
SS
SS
SS
SC
SC
SS
DO
DO
DI
DI
Symbol
These parameters are characterized, but not tested in manufacturing.
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The minimum clock period for SCKx is 40 ns.
Assumes 50 pF load on all SPIx pins.
V2
V2
L
H
F
R
H2
L2
H2
L2
L2
L2
H2
H2
L2
L2
F
R
SC
SC
SC
SC
DO
DO
DI
SS
DO
DI
DO
SS
L
L,
H,
L
H,
L
H
V
V
H
V,
Z SSx ↑ to SDO
SP40
SP60
Figure 29-1
SPIx MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SSx ↓ to SCKx ↓ or SCKx ↑
Input
High-Impedance
SSx ↑ after SCKx Edge
SDOx Data Output Valid after
SSx Edge
SP50
Characteristics
MSb In
SP71
SP41
MSb
for load conditions.
X
SP30,SP31
(4)
Output
SP70
(3)
(3)
(1)
Bit 14 - - - - - -1
Bit 14 - - - -1
(4)
(4)
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
T
T
T
SCK
Min.
SCK
SCK
175
SP35
10
10
20
—
—
—
—
—
—
—
5
/2
/2
+
Typical
SP73
SP72
LSb
—
—
—
—
—
—
—
—
—
—
—
—
LSb In
5
5
(2)
SP72
SP73
Max.
10
10
20
30
25
25
—
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
SP52
© 2011 Microchip Technology Inc.
Units
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
See parameter DO32
See parameter DO31
Conditions
V
V
DD
DD
—
—
—
—
—
—
—
—
—
—
> 2.7V
< 2.7V
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