DSPIC30F2012-20I/SP Microchip Technology Inc., DSPIC30F2012-20I/SP Datasheet - Page 164

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DSPIC30F2012-20I/SP

Manufacturer Part Number
DSPIC30F2012-20I/SP
Description
16 BIT MCU/DSP 28LD 20MIPS 12 KB FLASH
Manufacturer
Microchip Technology Inc.
Type
DSPr
Datasheet

Specifications of DSPIC30F2012-20I/SP

A/d Inputs
10-Channels, 12-Bit
Cpu Speed
30 MIPS
Eeprom Memory
0 Bytes
Input Output
20
Interface
I2C/SPI/UART, USART
Ios
20
Memory Type
Flash
Number Of Bits
16
Package Type
28-pin SPDIP
Programmable Memory
12K Bytes
Ram Size
1K Bytes
Timers
3-16-bit, 1-32-bit
Voltage, Range
2.5-5.5
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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Part Number:
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Manufacturer:
Microchip Technology
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dsPIC30F2011/2012/3012/3013
FIGURE 20-7:
TABLE 20-22: BAND GAP START-UP TIME REQUIREMENTS
DS70139D-page 162
AC CHARACTERISTICS
SY40
Note 1:
Param
(see Note)
Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.
Enable Band Gap
No.
2:
T
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
BGAP
0V
Band Gap Start-up Time
BAND GAP START-UP TIME CHARACTERISTICS
Characteristic
(1)
SY40
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
Typ
40
(2)
Max
65
Units
-40°C
-40°C
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13> bit
T
T
A
A
+85°C for Industrial
+125°C for Extended
© 2006 Microchip Technology Inc.
Conditions
V
BGAP
Band Gap
Stable

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