ISP1161A1BM ST-Ericsson Inc, ISP1161A1BM Datasheet - Page 135

• Manufacturer Part Number: ISP1161A1BM
• Description: IC USB HOST/DEVICE CTRLR 64-LQFP
• Manufacturer: ST-Ericsson Inc

Specifications of ISP1161A1BM

• Controller Type: USB 2.0 Controller
• Interface: Parallel
• Voltage - Supply: 3.3V, 5V
• Current - Supply: 47mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-1163; ISP1161A1BM,557

Philips Semiconductors
25. Revision history
Table 128: Revision history
9397 750 13961
Product data
Rev Date
03
02
01
20041223
20030825
20021220
CPCN
200412020
-
-
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Description
Product data (9397 750 13961)
Modifications:
Product data (9397 750 11828)
Product data (9397 750 10241)
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
•
•
•
•
Section 9.8.1 “Using an internal OC detection
sentence, changed source to drain and drain to source
Section 11.4 “Suspend and
Removed Section 20.1 Timing symbols
Table 118 “Dynamic characteristics: DC Programmed interface
min value of t
and t
SHWL
.
Rev. 03 — 23 December 2004
RHAX
from 3 ns to 0 ns and of t
resume”: updated the entire section
USB single-chip host and device controller
WHAX
10 C measured in the atmosphere of the reflow
circuit”: fourth paragraph, second
from 3 ns to 1 ns, and added t
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
ISP1161A1
timing”: changed the
134 of 136
SHRL