ISP1760BEUM ST-Ericsson Inc, ISP1760BEUM Datasheet - Page 4

• Manufacturer Part Number: ISP1760BEUM
• Description: IC USB HOST CONTROLLER 128-LQFP
• Manufacturer: ST-Ericsson Inc

Specifications of ISP1760BEUM

• Controller Type: USB Peripheral Controller
• Interface: EHCI Interface
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Other names: 568-1887-2; ISP1760BE,518; ISP1760BE-T

4
World News | May - June 2004 | Technology
Breakthrough in embedded EEPROM technology
Easier software development
for attractive consumer products
Software is a vital element of today’s consumer devices, providing more
and more exciting new features and broad product differentiation.
However, creating robust and reliable software is a long and expensive
process. Philips is driving two far-reaching cooperative initiatives that
will simplify the creation of middleware and application software for the
consumer market.This in turn will cut time-to-market for exciting new
home entertainment products.
To speed the development of new products, consumer electronics (CE) manufacturers often
turn to independent software vendors (ISVs) for middleware and application software.
However, having to adapt code to suit the numerous silicon platforms that exist is a major
hindrance for ISVs when bringing new modules to market. In response, Philips and Samsung
have joined forces to develop the Universal Home Application Programming Interface
Philips Semiconductors’ new low-voltage embedded EEPROM option for
its 0.18 µm CMOS18 process delivers outstanding memory density and
power consumption levels.Targeting the need for increased storage and
flexibility in smart card, consumer, communications and automotive
applications, the new technology complements and extends Philips’
portfolio of non-volatile memory options.
Many new applications demand larger information storage from strictly limited power
budgets. For example, proposed security measures have heralded the arrival of electronic
passports. The chips in these passports must be contactless – so must draw energy from
a weak RF field – yet they also have to be able to store large amounts of biometric data
for identification purposes. The new byte-alterable CMOS18 EEPROM technology fulfils
both these requirements, providing high density and low power consumption. It is also fully
compatible with Philips’ existing embedded Flash memory option, enabling the creation of
highly flexible mixed Flash / EEPROM systems.
“With embedded ROM, EEPROM and Flash memory available in the same low-cost CMOS
process for all our 8-, 16- and 32-bit product families, we can implement a wide range
of non-volatile memory configurations,” said Bettina Kuhrt, Marketing Manager for Mobile
Communications Products, Security Solutions at Philips Semiconductors. “Whether
customers are looking for fast prototyping, production-line programming or the ability to
download Java applets onto a card, we can now provide the optimum mix of non-volatile
memory at voltage and power levels that suit high-performance applications as well as
contactless smart card solutions.”
The EEPROM process is based on a similar cell design to Philips’ proven 2-transistor NOR
Flash technology. Both use Fowler-Nordheim (FN) electron tunneling for programming and
erasure, resulting in very low power consumption. However, the EEPROM process features
a small increase in programming voltage, tighter control of the erase-distribution and
read-threshold voltages, and an increased gate area on the memory transistor for greater
charge injection. Together, these modifications have enabled a breakthrough in byte-erase
time for FN-based devices, lowering it to below 1 ms. Crucially, none of these techniques
compromises the performance of the baseline CMOS18 process, enabling a true embedded
memory technology that is highly reliable – an important factor in many markets.
Furthermore, the new option dramatically reduces cell size – from 5 µm
0.18 µm embedded EEPROM technologies down to just 1.2 µm
of 2 Mbit (256 Kbyte) memories in a silicon area compatible with cost constraints of smart
card applications. Philips has also shown that the technology can be successfully shrunk
to 0.15 µm, with early indications that further migration to 0.13 µm and sub-100 nm
2
. This enables the creation
2
for conventional
(UHAPI). The UHAPI is a common framework for software creation and aims to make
the development process more efficient while offering CE companies the flexibility to
differentiate their products. Once finalized, it will act as a bridge between hardware and
higher-level software, allowing ISVs to develop hardware-independent modules and cutting
time-to-market for complete hardware / software solutions.
The UHAPI consists of a set of software interfaces for configuring and controlling audio- and
video-related components of a semiconductor platform. It targets a wide range of consumer
applications including analog and digital televisions, DVD players and recorders, set-top boxes,
personal video recorders and home servers.Together, the semiconductor divisions of Philips and
Samsung will establish, maintain and promote the UHAPI specification.They plan to invite other
companies to participate in enhancing the UHAPI and deploying it throughout the CE market.
The first UHAPI-compliant semiconductor products are expected to be released during 2004.
Philips’ involvement in the UHAPI is complemented by its Nexperia Home Partnership
Program (NHPP).This initiative is aimed at ISVs and system integrators who wish to create
middleware and application software for ‘Connected Consumer’ devices. It offers a complete
set of technical tools, information and joint marketing programs. In addition, complete
software development kits are planned and will include development hardware, software
applications, a documented API and an operating system. The first of these kits is aimed at
digital TV and is based on the Nexperia PNX8550 Home Entertainment Engine. A similar
kit for DVD+RW will be available in the second half of this year.
Fourteen leading ISVs have already joined the NHPP.They are Allegro Software, ANT Limited,
Blunk Microsystems, BORES Signal Processing, Cabot Communications, DivXNetworks,
ICT Embedded, Mediabolic, Momentum Data Systems, Ordina, Planetweb, S3, Streaming
Networks and Wind River Systems. These companies are developing software-based
products complementing the Nexperia Home Family semiconductor system solutions.
Combining software and hardware in this way enables a wide range of new opportunities
for manufacturers of innovative consumer electronics products.
processes is possible. The ability to migrate a process option encourages IP re-use, offering
manufacturers a cost-effective way to increase functionality and memory capacity as future
applications demand.
The new EEPROM option is available for design-in now and is supported by all the company’s
CMOS18 design tools, including the provision of memory test facilities through a standard
JTAG interface.
Technology continue
Technology continue
www.semiconductors.philips.com
/products/nexperia/home/partner
www.uhapi.org/
Philips Semiconductors
joins the MIPI Alliance
Further strengthening its commitment to open standards, Philips
Semiconductors has joined other leading mobile communications
companies in the Mobile Industry Processor Interface (MIPI)
Alliance. The MIPI Alliance aims to develop and promote industry
standards for interfaces to mobile application processors.
The MIPI Alliance comprises around forty leading companies, drawn from virtually
every segment of the mobile communications industry. It is intended to complement
existing standards bodies and focuses on microprocessors, peripherals and software
interfaces. By establishing specifications for standard hardware and software interfaces
to mobile application processors and encouraging their adoption throughout the
industry value chain, the MIPI Alliance will allow handset manufacturers to source
peripherals from numerous suppliers. These standards will simplify development and
encourage IP re-use, providing a cost-effective way to speed the advent of future-
generation handsets and the deployment of new services.
www.semiconductors.philips.com
Technology continue
/news/infocus/mipi_alliance
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