MC7448VS1000NC Freescale Semiconductor, MC7448VS1000NC Datasheet - Page 29
MC7448VS1000NC
Manufacturer Part Number
MC7448VS1000NC
Description
IC MPU RISC 1000MHZ 360-FCCLGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC7448VU1000LD.pdf
(60 pages)
Specifications of MC7448VS1000NC
Processor Type
MPC74xx PowerPC 32-Bit
Speed
1.0GHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
360-FCCLGA
Lead Free Status / RoHS Status
Contains lead / RoHS Compliant
Features
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8
The following sections provide the package parameters and mechanical dimensions for the HCTE
package.
8.1
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE).
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Coefficient of thermal expansion12.3 ppm/°C
Package Parameters for the MPC7448, 360 HCTE BGA
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
25 × 25 mm
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.32 mm
2.80 mm
0.89 mm (35 mil)
Package Description
29
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