XC2VP7-6FFG896C Xilinx Inc, XC2VP7-6FFG896C Datasheet - Page 428

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XC2VP7-6FFG896C

Manufacturer Part Number
XC2VP7-6FFG896C
Description
IC FPGA VIRTEX-II PRO 896-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet

Specifications of XC2VP7-6FFG896C

Number Of Logic Elements/cells
11088
Number Of Labs/clbs
1232
Total Ram Bits
811008
Number Of I /o
396
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
896-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-

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R
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF1696 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 10: FF1696 Flip-Chip Fine-Pitch BGA Package Specifications
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
300

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