EP3C16F484C7N Altera, EP3C16F484C7N Datasheet - Page 18
![IC CYCLONE III FPGA 16K 484FBGA](/photos/6/72/67258/544-484-fbga_sml.jpg)
EP3C16F484C7N
Manufacturer Part Number
EP3C16F484C7N
Description
IC CYCLONE III FPGA 16K 484FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
6.EP3C10M164C8N.pdf
(350 pages)
7.EP3C16F484C7N.pdf
(274 pages)
Specifications of EP3C16F484C7N
Number Of Logic Elements/cells
15408
Number Of Labs/clbs
963
Total Ram Bits
516096
Number Of I /o
346
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
15408
# I/os (max)
346
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
15408
Ram Bits
516096
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
No. Of Logic Blocks
963
Family Type
Cyclone III
No. Of I/o's
346
I/o Supply Voltage
3.3V
Operating Frequency Max
437.5MHz
Operating Temperature Range
0°C To +85°C
Rohs Compliant
Yes
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200P0037 - BOARD DEV/EDUCATION ALTERA DE0544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2473
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C16F484C7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Page 18
f
f
f
For details about implementing these features, refer to the
volume 2 of the Quartus II Handbook.
Minimizing Simultaneous Switching Noise
Simultaneous switching noise (SSN) becomes a concern when too many pins within
close proximity change levels at the same time and cause V
on the quiet pins nearby. Noise generated by SSN can reduce noise margin and cause
incorrect switching.
When creating your design, try to separate the pins that switch simultaneously. If
possible, distribute the switching pins to different I/O banks. Set the unused I/O pins
nearby to V
also turn on the slow slew rate feature and use a lower drive strength for the
switching pins. Proper termination on the switching I/O pins also helps to reduce
reflection and the SSN effect on the quiet pins.
For details about the sources of the SSN, ways to mitigate SSN and guidelines on a
PCB design for the general high speed digital designs, refer to
Simultaneous Switching Noise (SSN) Design Guidelines.
For board design guidelines, refer to
AN 315: Guidelines for Designing High-Speed FPGA PCBs.
Unused Pin Connection
The Quartus II software generates the pin report file (.pin) when you compile your
design. This report file specifies how you should connect the unused pins of your
device. For a Cyclone III device, unused I/O pins are marked in the report file as any
one of the following depending on how you set the unused pins in the Quartus II
software:
■
■
■
■
■
All I/O pins specified as GND* can either be connected to ground to improve the
device's immunity to noise, or left unconnected. Leave all RESERVE I/O pins
unconnected on your board because these I/O pins drive out unspecified signals.
Tying a RESERVED I/O pin to V
contention that can damage the output driver of the device.
RESERVED_INPUT I/O pins can be connected to a high or low signal on the board
while RESERVED_INPUT_WITH_WEAK_PULLUP and
RESERVED_INPUT_WITH_BUS_HOLD pins can be left unconnected.
GND*
RESERVED
RESERVED_INPUT
RESERVED_INPUT_WITH_WEAK_PULLUP
RESERVED_INPUT_WITH_BUS_HOLD
CC
to minimize V
CC
sag, or to ground to minimize ground bounce. You can
CC
, ground, or another signal source can create
AN 224: High-Speed Board Layout Guidelines
© November 2008 Altera Corporation
I/O Management
CC
sag or ground bounce
AN 508: Cyclone III
Board Design Considerations
chapter in
and