EP3C16F484C7N Altera, EP3C16F484C7N Datasheet - Page 26
![IC CYCLONE III FPGA 16K 484FBGA](/photos/6/72/67258/544-484-fbga_sml.jpg)
EP3C16F484C7N
Manufacturer Part Number
EP3C16F484C7N
Description
IC CYCLONE III FPGA 16K 484FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
6.EP3C10M164C8N.pdf
(350 pages)
7.EP3C16F484C7N.pdf
(274 pages)
Specifications of EP3C16F484C7N
Number Of Logic Elements/cells
15408
Number Of Labs/clbs
963
Total Ram Bits
516096
Number Of I /o
346
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
15408
# I/os (max)
346
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
15408
Ram Bits
516096
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
No. Of Logic Blocks
963
Family Type
Cyclone III
No. Of I/o's
346
I/o Supply Voltage
3.3V
Operating Frequency Max
437.5MHz
Operating Temperature Range
0°C To +85°C
Rohs Compliant
Yes
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200P0037 - BOARD DEV/EDUCATION ALTERA DE0544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2473
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C16F484C7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
1–12
Reference and Ordering Information
Figure 1–1. Cyclone III Device Packaging Ordering Information
Figure 1–2. Cyclone III LS Device Packaging Ordering Information
Cyclone III Device Handbook, Volume 1
EP3C: Cyclone III
5
10
16
25
25E
40
55
80
120
E: Plastic Enhanced Quad Flat Pack (EQFP)
Q: Plastic Quad Flat Pack (PQFP)
F: FineLine Ball-Grid Array (FBGA)
U: Ultra FineLine Ball-Grid Array (UBGA)
M: Micro FineLine Ball-Grid Array (MBGA)
EP3CLS: Cyclone III LS
70
100
150
200
F: FineLine Ball-Grid Array (FBGA)
U: Ultra FineLine Ball-Grid Array (UBGA)
Package Type
Device Type
Family Signature
Package Type
Device Type
Family Signature
Figure 1–1
devices.
EP3C
EP3CLS
and
25
70
Figure 1–2
F
F
Number of pins for a particular package:
144
164
240
256
324
484
780
Number of pins for a particular package:
484
780
Pin Count
324
Pin Count
484
show the ordering codes for Cyclone III and Cyclone III LS
C
C
7
7
N
N
Indicates specific device options or
shipment method.
ES: Engineering sample
N: Lead-free devices
6 (fastest)
7
8
C: Commercial temperature (T
I: Industrial temperature (T
A: Automotive temperature (T
Indicates specific device options or
shipment method.
ES: Engineering sample
N: Lead-free devices
7 (fastest)
8
C: Commercial temperature (T
I: Industrial temperature (T
Operating Temperature
Speed Grade
Optional Suffix
Chapter 1: Cyclone III Device Family Overview
Operating Temperature
Speed Grade
Optional Suffix
© December 2009 Altera Corporation
Reference and Ordering Information
J
J
= -40
J
= -40
J
= -40
J
= 0
= 0
°
C to 100
°
°
C to 100
C to 85
°
°
C to 125
C to 85
°
°
C)
°
C)
°
C)
°
C)
C)