EP3C16F484C7N Altera, EP3C16F484C7N Datasheet - Page 15
![IC CYCLONE III FPGA 16K 484FBGA](/photos/6/72/67258/544-484-fbga_sml.jpg)
EP3C16F484C7N
Manufacturer Part Number
EP3C16F484C7N
Description
IC CYCLONE III FPGA 16K 484FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
6.EP3C10M164C8N.pdf
(350 pages)
7.EP3C16F484C7N.pdf
(274 pages)
Specifications of EP3C16F484C7N
Number Of Logic Elements/cells
15408
Number Of Labs/clbs
963
Total Ram Bits
516096
Number Of I /o
346
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
15408
# I/os (max)
346
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
15408
Ram Bits
516096
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
No. Of Logic Blocks
963
Family Type
Cyclone III
No. Of I/o's
346
I/o Supply Voltage
3.3V
Operating Frequency Max
437.5MHz
Operating Temperature Range
0°C To +85°C
Rohs Compliant
Yes
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200P0037 - BOARD DEV/EDUCATION ALTERA DE0544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2473
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C16F484C7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Cyclone III Device Family Features
Lowest Power FPGAs
© December 2009
CIII51001-2.2
Altera Corporation
Cyclone
power and low cost. Based on Taiwan Semiconductor Manufacturing Company
(TSMC) low-power (LP) process technology, silicon optimizations and software
features to minimize power consumption, Cyclone III device family provides the ideal
solution for your high-volume, low-power, and cost-sensitive applications. To address
the unique design needs, Cyclone III device family offers the following two variants:
■
■
With densities ranging from 5K to 200K logic elements (LEs) and 0.5 Mbits to 8 Mbits
of memory for less than ¼ watt of static power consumption, Cyclone III device
family makes it easier for you to meet your power budget. Cyclone III LS devices are
the first to implement a suite of security features at the silicon, software, and
intellectual property (IP) level on a low-power and high-functionality FPGA platform.
This suite of security features protects the IP from tampering, reverse engineering and
cloning. In addition, Cyclone III LS devices support design separation which enables
you to introduce redundancy in a single chip to reduce size, weight, and power of
your application.
This chapter contains the following sections:
■
■
■
Cyclone III device family offers the following features:
■
■
■
Cyclone III: lowest power, high functionality with the lowest cost
Cyclone III LS: lowest power FPGAs with security
“Cyclone III Device Family Features” on page 1–1
“Cyclone III Device Family Architecture” on page 1–6
“Reference and Ordering Information” on page 1–12
Lowest power consumption due to:
■
■
Low-power operation offers the following benefits:
■
■
■
Hot-socketing operation support
TSMC low-power process technology
Altera
Extended battery life for portable and handheld applications
Reduced or eliminated cooling system costs
Operation in thermally-challenged environments
®
III device family offers a unique combination of high functionality, low
®
power-aware design flow
1. Cyclone III Device Family Overview
Cyclone III Device Handbook, Volume 1