EP3SL150F1152C3N Altera, EP3SL150F1152C3N Datasheet - Page 246

IC STRATX III FPGA 150K 1152FBGA

EP3SL150F1152C3N

Manufacturer Part Number
EP3SL150F1152C3N
Description
IC STRATX III FPGA 150K 1152FBGA
Manufacturer
Altera
Series
Stratix® IIIr

Specifications of EP3SL150F1152C3N

Number Of Logic Elements/cells
142500
Number Of Labs/clbs
5700
Total Ram Bits
6390
Number Of I /o
744
Voltage - Supply
0.86 V ~ 1.15 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-FBGA
For Use With
544-2568 - KIT DEVELOPMENT STRATIX III
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-2408
EP3SL150F1152C3NES

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Manufacturer
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EP3SL150F1152C3N
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7–42
Chapter Revision History
Table 7–13. Chapter Revision History (Part 1 of 2)
Stratix III Device Handbook, Volume 1
July 2010
March 2010
May 2009
February 2009
October 2008
Date and Revision
Table 7–13
Version
1.9
1.8
1.7
1.6
1.5
lists the revision history for this chapter.
Updated for the Quartus II software version 9.1 SP2 release:
Text, Table, and Figure updates:
Updated
Updated
Updated “Programmable Pull-Up Resistor” section.
Updated Figure 7–2, Figure 7–3, Figure 7–4, Figure 7–5, Figure 7–6.
Updated Table 7–2, Table 7–3, and Table 7–7.
Added reference before Table 7–11.
Removed “Conclusion” section.
Minor text edit.
Updated “Expanded On-Chip Series Termination with Calibration” and
“Mixing Voltage-Referenced and Non-Voltage-Referenced Standards”
sections.
Added “Left Shift Series Termination Control” section.
Updated Table 7–8 and Table 7–9.
Updated Figure 7–24.
Updated Table 7–3, Table 7–7, Table 7–8, and Table 7–11.
Updated Figure 7–2, Figure 7–3, Figure 7–4, Figure 7–5, and Figure 7–6.
Updated “LVDS Input On-Chip Termination (R
Removed “Referenced Documents” section.
Updated Table 7–2, Table 7–4, Table 7–7, and Table 7–10.
Updated notes for Table 7–2.
Updated notes for Figure 7–3, Figure 7–4, Figure 7–5, Figure 7–6, and
Figure 7–7.
Updated “Stratix III I/O Banks”, “Modular I/O Banks”, “High-Speed
Differential I/O with DPA Support”, “Dynamic On-Chip Termination”,
“LVDS Input On-Chip Termination (RD)”, “Serial Data Transfer”, “LVDS”,
“RSDS”, “mini-LVDS”, “Voltage-Referenced Standards”, “Stratix III I/O
Banks”, “MultiVolt I/O Interface”, and “On-Chip Parallel Termination with
Calibration” sections.
Updated Figure 7–1.
Added Table 7–3.
Updated New Document Format.
Figure
Equation 7–1
7–25,
Figure
and
Changes Made
Equation
7–26, and
7–2.
Chapter 7: Stratix III Device I/O Features
Figure
© July 2010 Altera Corporation
D
7–28.
)” section.
Chapter Revision History

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