LTC2655IUF-H12#PBF Linear Technology, LTC2655IUF-H12#PBF Datasheet - Page 27

• Manufacturer Part Number: LTC2655IUF-H12#PBF
• Description: IC DAC 12BIT QUAD CUR OUT 20QFN
• Manufacturer: Linear Technology

Specifications of LTC2655IUF-H12#PBF

• Settling Time: 3.9µs
• Number Of Bits: 12
• Data Interface: I²C, Serial
• Number Of Converters: 4
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-WQFN Exposed Pad, 20-DQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -

PACKAGE DESCRIPTION
4.50 ± 0.05
3.10 ± 0.05
4.00 ± 0.10
2.00 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
VARIATION (WGGD-1)—TO BE APPROVED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
2.45 ± 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4.00 ± 0.10
2.45 ± 0.05
(Reference LTC DWG # 05-08-1710 Rev A)
20-Lead (4mm × 4mm) Plastic QFN
0.50 BSC
0.25 ±0.05
0.70 ±0.05
PACKAGE OUTLINE
UF Package
0.75 ± 0.05
0.200 REF
0.00 – 0.05
2.00 REF
R = 0.05
TYP
R = 0.115
BOTTOM VIEW—EXPOSED PAD
2.45 ± 0.10
TYP
2.45 ± 0.10
19
20
0.50 BSC
0.25 ± 0.05
LTC2655
0.40 ± 0.10
1
2
(UF20) QFN 01-07 REV A
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 × 45°
CHAMFER
27
2655f