MAX5891EGK+D Maxim Integrated Products, MAX5891EGK+D Datasheet - Page 2

• Manufacturer Part Number: MAX5891EGK+D
• Description: IC DAC 16BIT LVDS 600MSPS 68-QFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX5891EGK+D

• Settling Time: 11ns
• Number Of Bits: 16
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 301mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 68-QFN Exposed Pad
• Conversion Rate: 600 MSPs
• Resolution: 16 bit
• Interface Type: Parallel or LVDS
• Supply Voltage (max): 1.89 V, 3.465 V
• Supply Voltage (min): 1.71 V, 3.135 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
AV
AV
REFIO, FSADJ to AGND, DACREF,
OUTP, OUTN to AGND, DGND, DACREF,
CLKP, CLKN to AGND, DGND, DACREF,
PD to AGND, DGND, DACREF,
ELECTRICAL CHARACTERISTICS
(AV
transformer-coupled output, I
by production testing. Specifications at T
16-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
Note 1: Thermal resistance based on a multilayer board with 4x4 via array in exposed paddle area
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
STATIC PERFORMANCE
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Full-Scale Gain Error
Gain-Drift Tempco
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
Output Leakage Current
DYNAMIC PERFORMANCE
Maximum DAC Update Rate
Minimum DAC Update Rate
Noise Spectral Density
and CGND.......................................................-0.3V to +2.16V
DACREF, and CGND.........................................-0.3V to +3.9V
DGND, and CGND ..........................-0.3V to (AV
and CGND .......................................-1.2V to (AV
and CGND..........................................-0.3V to (AV
and CGND.......................................-0.3V to (DV
DD1.8
DD3.3
DD3.3
_______________________________________________________________________________________
, DV
, DV
= DV
PARAMETER
DD1.8
DD3.3
DD3.3
, AV
to AGND, DGND, DACREF,
= AV
CLK
CLK
to AGND, DGND,
OUT
= 3.3V, AV
= 20mA, T
SYMBOL
C
A
GE
R
DD1.8
DNL
I
INL
OS
OUT
OUT
OUT
< +25°C are guaranteed by design and characterization. Typical values are at T
N
FS
A
= -40°C to +85°C, unless otherwise noted. Specifications at T
= DV
DD3.3
DD3.3
DD3.3
Measured differentially
Measured differentially
External reference
Internal reference
External reference
Single-ended
PD = high, power-down mode
f
-12dBFS, 20MHz
offset from the
carrier
CLK
DD1.8
CLK
= 500MHz,
+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)
= 1.8V, external reference V
CONDITIONS
Digital Data Inputs (D0N–D15N, D0P–D15P) to AGND,
Continuous Power Dissipation (T
Thermal Resistance
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
f
A
f
A
OUT
OUT
FULL-SCALE
FULL-SCALE
DGND, DACREF, and CGND ..........-0.3V to (DV
68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW
= 36MHz
= 151MHz
= -3.5dBm
= -6.4dBm
REFIO
θ
= 1.2V, output load 50Ω double-terminated,
JA
(Note 1) ....................................24°C/W
-0.02
MIN
-1.0
600
-4
2
A
= +70°C) (Note 1)
±0.001
±130
±100
±3.8
±2.8
A
TYP
-163
-155
±1
16
±1
1
5
1
≥ +25°C are guaranteed
+0.02
MAX
+1.1
+4
20
DD1.8
A
= +25°C.)
dBFS/Hz
ppm/°C
UNITS
+ 0.3V)
Msps
Msps
%FS
%FS
LSB
LSB
Bits
MΩ
mA
pF
µA
V