1-2106431-1 TE Connectivity, 1-2106431-1 Datasheet - Page 3

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1-2106431-1

Manufacturer Part Number
1-2106431-1
Description
WIRE-BOARD CONN, RECEPTACLE, 1WAY, 4MM
Manufacturer
TE Connectivity
Datasheets

Specifications of 1-2106431-1

Connector Type
Wire To Board
Contact Termination
Surface Mount Horizontal
Gender
Receptacle
No. Of Contacts
1
No. Of Rows
1
Pitch Spacing
4mm
Contact Plating
Tin
Rohs Compliant
Yes
Connector Design
Feed Through
Strain Relief
With
Sealed
No
Termination Method To Pc Board
Surface Mount
Pcb Mount Retention
With
Pcb Mount Alignment
Without
Smt Compatible
Yes
Mount Angle
Right Angle
Wire/cable Type
Discrete Wire
Termination Method To Wire/cable
IDC
Keyed
No
Make First / Break Last
No
Contact Current Rating, Max (a)
9
Operating Voltage (vac)
250
Operating Voltage (vdc)
250
Tail Orientation
Staggered
Wire/cable Size (awg)
20
Tool-less Wire Termination
Yes
Profile Height (y-axis) (mm [in])
5.80 [0.228]
Number Of Positions
1
Number Of Rows
1
Length (x-axis) (mm [in])
5.70 [0.224]
Width (z-axis) (mm [in])
7.75 [0.305]
Post-mating Assembly Measurement (mm [in])
5.7 [0.224]
Header Mating Direction
Horizontal
Pcb Mount Retention Type
Solder Pads
Strain Relief Type
Terminating Covers
Tail Plating Material
Matte Tin-Lead over Nickel
Tail Plating, Thickness (µm [?in])
5.08 [200]
Contact Plating, Mating Area, Material
Matte Tin
Contact Plating, Mating Area, Thickness (µm [?in])
5.08 [200]
Stamped And Formed
Yes
Housing Material
Liquid Crystal Polymer (LCP)
Housing Color
Natural
Ul Flammability Rating
UL 94V-0
Pre-designed Cables Available
No
Agency/standard
CSA, UL
Agency/standard Number
C22.2 No. 182.3-M1987, UL 1977
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Rohs/elv Compliance History
Always was RoHS compliant
Circuit Identification Feature
Without
Operating Temperature (°c [°f])
-40 – +105 [-40 – +221]
Applies To
Printed Circuit Board
Accepts Wire Insulation Diameter, Range (mm [in])
1.90 [0.075]
Smt Soldering Temperature (°c [°f])
220 [428]
Lighting Interconnect Level
Level 1
Glow Wire Rating
No
Uv Exposure Rated
No
Application Use
Wire-to-Board
Packaging Method
SMT Pocket Tape
Mechanical shock.
Wire insertion force.
Termination tensile strength,
parallel.
Termination tensile strength,
perpendicular.
Thermal shock.
Humidity/temperature cycling.
Temperature life.
Rev A
NOTE
Test Description
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
2.
No discontinuities of 1 microsecond
or longer duration.
See Note.
See Figure 5
See Note.
See Note.
See Note.
18 stranded
24 stranded
18 stranded
24 stranded
Wire Size
Wire Size
18 solid
24 solid
18 solid
24 solid
(AWG)
(AWG)
ENVIRONMENTAL
Figure 1 (end)
Requirement
(N [lbf] minimum)
(N [lbf] minimum)
Crimp Tensile
Crimp Tensile
53.4 [12]
17.8 [4]
102 [23]
44.5 [10]
13.5 [3]
22.2 [5]
8.9 [2]
8.9 [2]
EIA-364-27, Method H.
Subject specimens to 30 G's half-
sine shock pulses of 11
milliseconds duration. Three shocks
in each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
EIA-364-13.
Measure force necessary to insert
wires at a maximum rate of 12.7
mm [.5 in] per minute.
EIA-364-8.
Determine tensile strength by
pulling parallel to terminated wire
at a maximum rate of 12.7 mm [.5
in] per minute.
See Figure 6.
EIA-364-8.
Determine tensile strength by
pulling perpendicular to terminated
wire at a maximum rate of 12.7 mm
[.5 in] per minute.
See Figure 7.
EIA-364-32, Test Condition VIII.
Subject specimens to 25 cycles
between -40 and 105°C with 30
minute dwells at temperature
extremes and 1 minute transition
between temperatures.
EIA-364-31, Method III.
Subject specimens to 10 cycles (10
days) between 25 and 65°C at 80 to
100% RH.
EIA-364-17, Method A, Test
Condition 4.
Subject specimens to 105°C for 648
hours.
Procedure
108-2404
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