36501E22NJTDG TE Connectivity, 36501E22NJTDG Datasheet - Page 7
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36501E22NJTDG
Manufacturer Part Number
36501E22NJTDG
Description
3650 0402 22nH 5% 2K RL
Manufacturer
TE Connectivity
Series
3650r
Datasheet
1.36501E10NJTDG.pdf
(9 pages)
Specifications of 36501E22NJTDG
Inductance
22nH
Inductance Tolerance
± 5%
Dc Resistance Max
0.3ohm
Dc Current Rating
400mA
Inductor Case Style
0402
No. Of Pins
2
Svhc
No SVHC (15-Dec-2010)
Dc Current Max
400mA
Rohs Compliant
Yes
Product Type
Inductor
Inductor Type
High Frequency
Element
Wirewound
Inductance (µh)
0.022
Dc Resistance (?)
0.3
Current, Maximum (ma)
400
Quality Factor
25
Package Type
Taped and Reeled
Shielded
No
Tolerance (%)
5
Lead Type
Surface Mount Terminals
Packaging Style
0402
Package, Component Size
1.5 x 0.5
Mount Style
Surface Mount
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Application
High Frequency
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
36501E22NJTDG
Manufacturer:
TE
Quantity:
60 000
Literature No. 1773163
Issued: 12-05
Dimensions are shown for
reference purposes only.
Environmental Characteristics -
Mechanical Performance
Electrical Performance
Low Inductance, High Frequency Chip Inductor
Type 3650 Series
Item
Vibration Test:
Resistance to
Soldering Heat:
Component Adhesion:
(Push Test)
Drop Test:
Solderability Test:
Resistance to Solvent Test:
Item
Inductance:
Q:
SRF:
DC Resistance R
Rated Current IDC:
Overload Test:
Withstanding Voltage Test:
Insulation Resistance Test:
dc
:
Dimensions are in millimetres
unless otherwise specified.
REFER to Standard Electrical
Characteristic List
Specification
1 lbs. For 0402
2 lbs. For 0603
3 lbs. For the rest
After test, there shall be no
evidence of electrical or
mechanical damage
The terminal should at least be
90% covered with solder.
There shall be no case of
deformation change in
appearance or obliteration of
marking
Specification
After test, there shall be
no evidence of electrical and
mechanical damage
After test, there shall be no
evidence of electrical and
mechanical damage.
1000M OHM MIN.
Appearance: No damage
∆L ≤±5%
∆Q ≤±10%
Specifications subject to
change.
Test Method
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm
Time: 2hrs for each axis (X, Y &Z), total 6hrs
Solder Temperature: 260±5°C
Immersion Time: 10±2sec
The device should be REFLOW soldered
(230±5°C for 10 seconds) to a tinned copper
substrate. A dynamiter force gauge should be
applied to the side of the component. The device
must with stand a minimum force of 2 or 4
pounds without a failure of the termination
attached to component.
Drop once for each face and once for each
corner. Total drop 10 Times.
Drop height :100cm
Drop weight:125g
After fluxing (alpha 100 or equiv), inductor shall
be dipped in a melted solder bath at 260±5°C
for 5 seconds.
MIL-STD202F,METHOD 215D
Test Method
HP4291B
HP4291B
HP8753D
Micro-Ohmeter (Gom-801G)
Applied the current to coils, ∆L <10%
Applied 2 times rated current for 5 minutes
Ac voltage of 500 VAC applied between inductors
terminal and case for 1 minute.
100 VDC applied between inductor terminal
and case
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