MPC561MZP56 Freescale, MPC561MZP56 Datasheet - Page 1310
MPC561MZP56
Manufacturer Part Number
MPC561MZP56
Description
Manufacturer
Freescale
Datasheet
1.MPC561MZP56.pdf
(1420 pages)
Specifications of MPC561MZP56
Cpu Family
MPC56x
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
56MHz
Interface Type
QSPI/SCI/SPI/UART
Total Internal Ram Size
32KB
# I/os (max)
56
Number Of Timers - General Purpose
22
Operating Supply Voltage (typ)
2.6/5V
Operating Supply Voltage (max)
2.7/5.25V
Operating Supply Voltage (min)
2.5/4.75V
On-chip Adc
2(32-chx10-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
388
Package Type
BGA
Program Memory Type
ROMLess
Program Memory Size
Not Required
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC561MZP56
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC561MZP56R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
- Current page: 1310 of 1420
- Download datasheet (11Mb)
66-MHz Electrical Characteristics
An estimation of the chip junction temperature, T
where:
The junction to ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. Unfortunately, the answer is only an estimate; test cases have
demonstrated that errors of a factor of two are possible. As a result, more detailed thermal characterization
is supplied.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal
resistance and a case to ambient thermal resistance:
where:
G-4
1
2
3
4
5
6
7
8
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per SEMI G38-87 and JESD51-2 with the board horizontal.
These values are the mean + 3 standard deviations of characterized data.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board (Four layer (2s2p) board, natural convection).
Indicates the thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per EIA/JESD51-2.
T
T
R
P
R
R
R
R
A
D
J
θJA
θJA
θJA
θJC
θJA
= T
= ambient temperature (°C)
= power dissipation in package
= junction to case thermal resistance (°C/W)
= package junction to ambient resistance (°C/W)
= R
= junction to ambient thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
A
+ (R
θJC
Characteristic
θJA
+ R
θCA
x P
Table G-2. Thermal Characteristics (continued)
D
)
MPC561/MPC563 Reference Manual, Rev. 1.2
J
, in °C can be obtained from the equation:
Symbol
R
R
Ψ
θJB
θJT
JT
21.2
Value
7.0
1.6
3,7
8
3,6
Freescale Semiconductor
°C/W
°C/W
°C/W
Unit
Related parts for MPC561MZP56
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
MPC5 1K0 5%
Manufacturer:
TE Connectivity
Datasheet:
Part Number:
Description:
MPC5 500R 5%
Manufacturer:
TE Connectivity
Datasheet:
Part Number:
Description:
MPC5 5K0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC5 5R0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC5 50K 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
MPC5 1R0 5%
Manufacturer:
Tyco Electronics
Datasheet:
Part Number:
Description:
TOWER ELEVATOR BOARDS HARDWARE
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
TOWER SERIAL I/O HARDWARE
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
LCD MODULE FOR TWR SYSTEM
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
DAUGHTER LCD WVGA I.MX51
Manufacturer:
Freescale Semiconductor
Datasheet:
Part Number:
Description:
TOWER SYSTEM BOARD MPC5125
Manufacturer:
Freescale Semiconductor
Datasheet: