HS9-6664RH/PROTO Intersil, HS9-6664RH/PROTO Datasheet
HS9-6664RH/PROTO
Specifications of HS9-6664RH/PROTO
Related parts for HS9-6664RH/PROTO
HS9-6664RH/PROTO Summary of contents
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... HS9-6664RH-8 5962F9562601VXC HS1-6664RH-Q 5962F9562601VYC HS9-6664RH-Q HS1-6664RH/PROTO HS1-6664RH/PROTO HS9-6664RH/PROTO HS9-6664RH/PROTO 1 1-888-INTERSIL or 321-724-7143 August 2000 Features • Electrically Screened to SMD # 5962-95626 • QML Qualified per MIL-PRF-38535 Requirements • 1.2 Micron Radiation Hardened Bulk CMOS • Total Dose . . . . . . . . . . . . . . . . . . . . . . 300 krad(Si) (Max) • Transient Output Upset . . . . . . . . . . . . . . >5x10 • ...
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Pinouts 28 LEAD CERAMIC (SBDIP) CASE OUTLINE D28.6 MIL-STD-1835, CDIP2-T28 TOP VIEW A12 DQ0 12 DQ1 13 DQ2 14 GND ...
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... NC VSS GND SS STATIC CONFIGURATION NOTES: 1. Power Supply: VDD = 5.5V (Min) Resistors = 10kΩ ± 10% 2. Irradiation Circuit NOTES: VDD = 5.5V ± ±0.5V 9. Power Supply: All Resistors = 47kΩ ± 10% 10. 3 HS-6664RH HS9-6664RH 28 LEAD (8kx8 PROM FLATPACK) VDD VDD F13 A11 ...
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Die Characteristics DIE DIMENSIONS: 271milsx307milsx19mils ±1mils INTERFACE MATERIALS: Glassivation: Type: SiO 2 Å Å ± 1k Thickness: 8k Top Metallization: Å Å M1:6k ±±1k Si/Al/Cu Å Å 2k ±±500 TiW Å Å ± 2k M2:10k Si/Al/Cu Metallization Mask Layout 4 ...
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