S71PL032J04BAW0B0 Spansion Inc., S71PL032J04BAW0B0 Datasheet - Page 19
S71PL032J04BAW0B0
Manufacturer Part Number
S71PL032J04BAW0B0
Description
Manufacturer
Spansion Inc.
Datasheet
1.S71PL032J04BAW0B0.pdf
(24 pages)
Specifications of S71PL032J04BAW0B0
Operating Supply Voltage (max)
3.1V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
TSB064—64-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 11.6 mm Package
March 17, 2006 S71PL-J_00_B3
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
A1
A2
D1
E1
eE
eD
φb
D
A
E
n
CORNER
0.15 C
(2X)
PIN A1
A2
A1
C1,C2,C9,C10,D1,D10,E1,E10
H1,H10,J1,J10,K1,K2,K9,K10
F1,F5,F6,F10,G1,G5,G6,G10
M2,M3,M4,M5,M6,M7,M8,M9
B1,B2,B3,B4,B7,B8,B9,B10
MIN
0.81
0.35
017
A2,A3,A4,A5,A6,A7,A8,A9
---
L1,L2,L3,L4,L7,L8,L9,L10
11.60 mm x 8.00 mm
64X
INDEX MARK
0.15
0.08
11.60 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TSB 064
10
6
NOM
0.40
N/A
b
12
10
64
---
---
---
M C A B
M C
A d v a n c e
MAX
1.20
0.97
0.45
---
SIDE VIEW
TOP VIEW
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
I n f o r m a t i o n
NOTE
S71PL-J Based MCPs
C
A
0.15
(2X)
E
B
C
eE
0.20
0.08
10
eD
C
C
9
8
7
6
5
4
3
2
1
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
J
7
BOTTOM VIEW
H
G
D1
F
E
D
C
B
A
SE
CORNER
PIN A1
3351 \ 16-038.22a
7
E1
17