STAC9200X3TAEB1X IDT, Integrated Device Technology Inc, STAC9200X3TAEB1X Datasheet - Page 122
STAC9200X3TAEB1X
Manufacturer Part Number
STAC9200X3TAEB1X
Description
Manufacturer
IDT, Integrated Device Technology Inc
Datasheet
1.STAC9200X3TAEB1X.pdf
(126 pages)
Specifications of STAC9200X3TAEB1X
Single Supply Voltage (typ)
3.3V
Single Supply Voltage (min)
3.135V
Single Supply Voltage (max)
3.465V
Package Type
TQFP
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STAC9200X3TAEB1X
Manufacturer:
IDT
Quantity:
20 000
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9. SOLDER REFLOW PROFILE
IDT™
STAC9200
2-CHANNEL HIGH DEFINITION AUDIO CODEC
Time maintained above
9.1.
Time within 5
2-CHANNEL HIGH DEFINITION AUDIO CODEC
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Note: All temperatures refer to topside of the package, measured on the package body surface.
Standard Reflow Profile Data
Peak / Classification Temperature (Tp)
Preheat
Average Ramp-Up Rate (Ts
o
Profile Feature
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
min
max
Time (t
Figure 5. Solder Reflow Profile
- ts
- Tp)
max
max
min
L
L
IDT CONFIDENTIAL
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
on page 123.
20 - 40 seconds
6
8 minutes max
o
C for 3 to 5 seconds.
o
o
C / second max
C / second max
122
o
o
o
C
C
C
Pb Free Assembly
STAC9200
PC AUDIO
V 1.6 01/08
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