SC16C654DBIB64,518 NXP Semiconductors, SC16C654DBIB64,518 Datasheet - Page 52

• Manufacturer Part Number: SC16C654DBIB64,518
• Manufacturer: NXP Semiconductors

Specifications of SC16C654DBIB64,518

• Transmit Fifo: 64Byte
• Receive Fifo: 64Byte
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Package Type: LQFP
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
Fig 31. Package outline SOT686-1 (LFBGA64)
9397 750 14965
Product data sheet
LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 6 x 6 x 1.05 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT686-1
max.
ball A1
index area
ball A1
index area
1.5
A
0.3
0.2
A
1
G
K
H
D
C
B
A
F
E
J
1.20
0.95
A
2
1
IEC
0.35
0.25
2
b
e
3
4
6.1
5.9
D
5
e 1
D
6
6.1
5.9
E
1/2
7
JEDEC
- - -
e
8 9 10
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
0.5
e
0
REFERENCES
Rev. 02 — 20 June 2005
b
4.5
e 1
4.5
1/2
e 2
B
JEITA
scale
e
- - -
2.5
e
A
E
w
v
0.15
e 2
M
M
v
C
C
0.05
A
w
B
5 mm
0.08
y
A
SC16C654B/654DB
0.1
y 1
A 2
y 1 C
A
1
detail X
PROJECTION
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
EUROPEAN
X
C
y
ISSUE DATE
02-03-11
SOT686-1
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