803774 Bergquist, 803774 Datasheet

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803774

Manufacturer Part Number
803774
Description
BOARD LED IMS SEOUL SEMI P5
Manufacturer
Bergquist
Series
Thermal Clad® IMS®r
Type
Thermal Clad Boardr
Datasheet

Specifications of 803774

Shape
Star
For Use With/related Products
Seoul Semiconductor Z-Power P5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Solutions
For Surface Mount
Power Applications
ThermalClad
®
S E L E C T I O N
G U I D E

Related parts for 803774

803774 Summary of contents

Page 1

Thermal Solutions For Surface Mount Power Applications ThermalClad ® ...

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September 2009 Thermal Clad All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND ...

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... Dielectric Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Summary Of Key Dielectric Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Using Dielectric Materials In Specialty Applications . . . . . . . . . . . . . . . . . . . . . . . .10-11 Design Considerations Selecting The Base Metal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-13 Selecting A Circuit Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-15 Electrical Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-17 Assembly Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18-19 Other Bergquist Thermal Products Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Thermal Clad Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20-21 1 ...

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... Additional ben- efits of Thermal Clad include lower operating temperatures, longer component life and increased durability. Bergquist Thermal Clad substrates are not limited to use with metal base layers. In one example, power conversion applica- tions can enhance their performance by replacing FR-4 with Thermal Clad dielectrics in multi-layer assemblies ...

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... With Thermal Clad, many discrete devices can be replaced at the board level. Bergquist’s manufacturing facility located in Prescott, Wisconsin features state-of-the-art process capabilities. Process manufacturing uses the latest in technology including environmental clean room control, surface finishing, coating and lamination. ...

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Thermal Clad Applications Power Conversion Due to the size constraints and watt-density requirements in DC-DC conversion, Thermal Clad has become the favored choice.Thermal Clad is available in a variety of thermal perfor- mances, is compatible with mechanical fasten- ers and ...

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... In state-of-the-art laboratories and test facilities, Bergquist performs extensive testing on all their thermal materials for electrical integrity. Bergquist utilizes stringent development procedures.The lab facilities at Bergquist are U.L. cer tified and manufacturing facilities are ISO 9001:2000 certified. Physical Properties ...

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Selecting Dielectric Materials Dielectric Layer The technology of Thermal Clad resides in the dielectric layer the key element for optimizing performance in your application.The dielec- tric is a proprietary polymer/ceramic blend that gives Thermal Clad its excellent electrical ...

Page 9

... HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements. This thin dielectric at 0.0015" (38µm) has an ability to withstand high tem- peratures with a glass transition of 185°C and phenomenal thermal performance of 0.30°C/W. For detailed information, call Bergquist Sales or go online. 1.7 MP ...

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Dielectric Performance Considerations Peel Strength This chart graphs the stability of the bond strength between the dielectric and the circuit layer during temperature rise. Although bond strength goes down at higher temperatures, it main- tains at least 3 lbs/inch (0.53 ...

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... Description RD 2018 Note: For applications with an expected voltage over 480 Volts AC, Bergquist recommends a dielectric thickness greater than 0.003" (76µm). Note: Maximum test voltage is a function of material and circuit design.Typical proof test does not represent the maximum. Note: Circuit design is the most important consideration for determining safety agency compliance. ...

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... Using Thermal Clad Dielectric Material... Two-Layer Systems Using FR-4 Circuits Or Thermal Clad Circuits Bergquist dielectrics are ideal for applications requiring a two-layer solution.Two-layer constructions can provide shielding protection and additional electrical interconnects for higher component density. Bergquist dielectrics will provide superior thermal performance over traditional FR-4 constructions ...

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... Selective Dielectric Removal Bergquist has developed a process for selectively removing dielec- tric to expose the baseplate. This surface can be surface finished like the other circuit pads. We are not limited to geometry or size of the dielectric removal area ...

Page 14

Base Metal Layer Design Considerations Coefficient Of Thermal Expansion t And Heat Spreading Coefficient Of Thermal Expansion t And Solder Joints THERMAL CONDUCTIVITY METAL / ALLOY [W/mK] Copper 400 Aluminum 5052 150 Aluminum 6061 150 Coefficient Of Thermal Expansion And ...

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Base Thickness Copper and aluminum Thermal Clad is normally purchased in one of the standard-gauge thicknesses shown in the table below. Non-stan- dard thicknesses are also available. Electrical Connections To Base Plate If a connection to the base plate is ...

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... Temperature rise comparison graph depicts the significant difference between Bergquist Dielectric HT and FR-4. Additional comparison charts regarding all Bergquist Dielectrics are available. Note: No base metal used in calculation. Want a cost effective, optimized circuit design This Thermal Clad White Paper addresses specific design recommendations including mechanical, circuit, soldermask, fabrication and test options to help optimize your design ...

Page 17

... Ultra Thin Circuits utilizing Bond-Ply ® 450 PA. See pages 11 and 18 for additional information. 40 Watt TO-220 soldered to 1" by 1" (25mm x 25mm) Bergquist RD2018 T est Method 1 oz (35µm) circuit foil 3 oz (105µm) circuit foil 6 oz (210µm) circuit foil 10 oz (350µm) circuit foil .002" ...

Page 18

Electrical Design Considerations Proof Testing t Breakdown Voltage t Creepage Distance And Discharge t Proof Test The purpose of "Proof Testing" Thermal Clad substrates is to verify that no defects reside in the dielectric material. Because testing requires that voltages ...

Page 19

Leakage Current HiPot Testing Due to the variety of dielectric types, thicknesses and board layouts, not all boards test alike. All insulated metal substrates closely resemble a parallel plate capacitor during HiPot testing. Capacitance is equal to: ∈ ...

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... Note: Additional thickness and/or larger stencil opening may need to be utilized for RoHS compliance applications. Use profile recommended by the component manufacturer. Wire soldering on Thermal Clad. Standard stars and squares in the most popular LED footprints available through distribution. Contact Bergquist Sales for more information 3°C/s ...

Page 21

Connection Techniques Connection techniques common throughout the industry are being used successfully on Thermal Clad IMS substrates. Surface mount connectors are manufactured using plastic molding materials with thermal coefficients of expansion that roughly match the characteris- tics of the baseplate ...

Page 22

... Hi-Flow is commonly used to replace messy thermal grease. Bergquist phase change materials are specially compounded to prevent pump-out of the interface area, which is often associated with thermal grease.Typical applications for Hi-Flow materials include: • ...

Page 23

... Gap Fillers are available in cartridge or kit form. Power Device Top Efficiency In Thermal Materials For Today’s Changing Technology. Contact Bergquist for additional information regarding our Thermal Solutions.We are constantly innovating to offer you the greatest selection of options and flexibility to meet today’s changing technology. ® and Liqui-Bond ® ...

Page 24

Appendix ASTM D 149 D 150 D 257 D 374 D 3165 D 5470 IEC 60093 60243-1 60250 60626-2 IPC 2221 6012 600 TM-650 TM-650-2.4.22 TM-650-2.4.8 SM-840C Surface ANSI/IPC-SM-782 Mount ISO 4587 Adhesives 22 Test Methods for Dielectric Breakdown Voltage ...

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... Custom Circuit Bergquist Thermal Clad substrates are custom configured to your design parameters at our Prescott,Wisconsin facility. Our field applica- tion support personnel in conjunction with our mechanical and process engineers are available to assist you in taking your design from paper to finished product. Engineering is available for the following construction parameters and options. • ...

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Notes ...

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... NEW ZEALAND FINLAND NORWAY FRANCE Corporate Headquarters and Sales Office: 18930 West 78th Street Chanhassen, MN 55317 Toll Free: (800) 347-4572 • Main: (952) 835-2322 • Fax: (952) 835-0430 • www.bergquistcompany.com Thermal Products SOUTH KOREA Tel: 82-31-448-0382 Fax: 82-31-448-0383 PORTUGAL RUSSIA SINGAPORE ...

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