B32529-C 105-K169 EPCOS Inc, B32529-C 105-K169 Datasheet - Page 40

• Manufacturer Part Number: B32529-C 105-K169
• Manufacturer: EPCOS Inc

Specifications of B32529-C 105-K169

• Lead Free Status / RoHS Status: Compliant

3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Important notes
at the end of this document.
Embedding of capacitors in finished assemblies
B32520 ... B32529
General purpose (stacked/wound)
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