C8051F340-GQR Silicon Laboratories Inc, C8051F340-GQR Datasheet - Page 36
C8051F340-GQR
Manufacturer Part Number
C8051F340-GQR
Description
MCU 8-Bit C8051F34x 8051 CISC 64KB Flash 3.3V/5V 48-Pin TQFP T/R
Manufacturer
Silicon Laboratories Inc
Datasheet
1.C8051F340-GQR.pdf
(276 pages)
Specifications of C8051F340-GQR
Package
48TQFP
Device Core
8051
Family Name
C8051F34x
Maximum Speed
48 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
40
Interface Type
I2C/SMBus/SPI/UART/USB
On-chip Adc
17-chx10-bit
Number Of Timers
4
Ram Size
4.25 KB
Program Memory Size
64 KB
Program Memory Type
Flash
Operating Temperature
-40 to 85 °C
Available stocks
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Company:
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3 870
Company:
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C8051F340-GQR
Manufacturer:
Silicon Laboratories Inc
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Part Number:
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C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
36
Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 4.6. LQFP-32 Recommended PCB Land Pattern
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Table 4.5. LQFP-32 PCB Land Pattern Dimensions
Dimension
C1
C2
X1
Y1
E
Rev. 1.3
8.40
8.40
0.40
1.25
Min
0.80 BSC
Max
8.50
8.50
0.50
1.35
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