BF1211WR,115 NXP Semiconductors, BF1211WR,115 Datasheet - Page 3
![MOSFET N-CH DUAL GATE 6V SOT343R](/photos/5/63/56355/568-cmpak-4_sot343r_sml.jpg)
BF1211WR,115
Manufacturer Part Number
BF1211WR,115
Description
MOSFET N-CH DUAL GATE 6V SOT343R
Manufacturer
NXP Semiconductors
Datasheet
1.BF1211215.pdf
(16 pages)
Specifications of BF1211WR,115
Package / Case
CMPAK-4
Transistor Type
N-Channel Dual Gate
Frequency
400MHz
Gain
29dB
Voltage - Rated
6V
Current Rating
30mA
Noise Figure
0.9dB
Current - Test
15mA
Voltage - Test
5V
Configuration
Single Dual Gate
Continuous Drain Current
0.03 A
Drain-source Breakdown Voltage
6 V
Gate-source Breakdown Voltage
6 V
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Power Dissipation
180 mW
Transistor Polarity
N-Channel
Application
VHF/UHF
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
6V
Power Gain (typ)@vds
34@5VdB
Noise Figure (max)
2dB
Package Type
CMPAK
Pin Count
3 +Tab
Input Capacitance (typ)@vds
2.1@5V@Gate 1/1.1@5V@Gate 2pF
Output Capacitance (typ)@vds
0.9@5VpF
Reverse Capacitance (typ)
0.015@5VpF
Operating Temp Range
-65C to 150C
Mounting
Surface Mount
Number Of Elements
2
Power Dissipation (max)
180mW
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-1961-2
934057513115
BF1211WR
934057513115
BF1211WR
NXP Semiconductors
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. T
THERMAL CHARACTERISTICS
2003 Dec 16
BF1211
BF1211R
BF1211WR
V
I
I
I
P
T
T
R
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
SYMBOL
D
G1
G2
SYMBOL
TYPE NUMBER
stg
j
DS
tot
N-channel dual-gate MOS-FETs
th(j-s)
s
is the temperature of the soldering point of the source lead.
drain-source voltage
drain current (DC)
gate 1 current
gate 2 current
total power dissipation
storage temperature
junction temperature
thermal resistance from junction to soldering point
BF1211; BF1211R
BF1211WR
BF1211; BF1211R
BF1211WR
NAME
PARAMETER
plastic surface mounted package; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
PARAMETER
CAUTION
T
T
s
s
116 C; note 1
122 C; note 1
3
DESCRIPTION
CONDITIONS
PACKAGE
BF1211; BF1211R; BF1211WR
65
MIN.
VALUE
185
155
6
30
10
10
180
180
+150
150
Product specification
MAX.
VERSION
SOT143B
SOT143R
SOT343R
UNIT
K/W
K/W
V
mA
mA
mA
mW
mW
C
C
UNIT