BSP295E6327 Infineon Technologies, BSP295E6327 Datasheet

MOSFET N-CH 60V 1.8A SOT223

BSP295E6327

Manufacturer Part Number
BSP295E6327
Description
MOSFET N-CH 60V 1.8A SOT223
Manufacturer
Infineon Technologies
Series
SIPMOS®r
Datasheet

Specifications of BSP295E6327

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
300 mOhm @ 1.8A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
1.8A
Vgs(th) (max) @ Id
1.8V @ 400µA
Gate Charge (qg) @ Vgs
17nC @ 10V
Input Capacitance (ciss) @ Vds
368pF @ 25V
Power - Max
1.8W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
BSP295
BSP295INTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSP295E6327
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Feature
·
·
·
SIPMOS
Type
BSP295
Maximum Ratings, at T
Parameter
Continuous drain current
T
T
Pulsed drain current
T
Reverse diode dv/dt
I
Gate source voltage
ESD Sensitivity (HBM) as per MIL-STD 883
Power dissipation
T
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
S
A
A
A
A
N-Channel
Enhancement mode
dv/dt rated
Pb-free lead plating; RoHS compliant
=1.8A, V
=25°C
=70°C
=25°C
=25°C
DS
=40V, di/dt=200A/µs, T
Small-Signal-Transistor
Package
PG-SOT-223
j
= 25 °C, unless otherwise specified
jmax
Tape and Reel Information
L6327: 1000 pcs/reel
=150°C
Page 1
Rev 1.3
Symbol
I
I
dv/dt
V
P
T
D
D puls
GS
tot
j ,
T
stg
Marking
BSP295
-55... +150
55/150/56
Class 1
Product Summary
V
R
I
D
Value
DS
DS(on)
1.44
±20
1.8
7.2
1.8
6
PG-SOT-223
4
2007-02-07
0.3
1.8
60
BSP295
1
Unit
A
kV/µs
V
W
°C
2
VPS05163
V
A
3

Related parts for BSP295E6327

BSP295E6327 Summary of contents

Page 1

SIPMOS Small-Signal-Transistor Feature · N-Channel · Enhancement mode · dv/dt rated • Pb-free lead plating; RoHS compliant Type Package PG-SOT-223 BSP295 Maximum Ratings Parameter Continuous drain current T =25° =70°C A Pulsed drain current T ...

Page 2

Thermal Characteristics Parameter Characteristics Thermal resistance, junction - soldering point SMD version, device on PCB: @ min. footprint cooling area Electrical Characteristics Parameter Static Characteristics Drain-source breakdown voltage V =0, I =250µA GS ...

Page 3

Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate ...

Page 4

Power dissipation tot A BSP295 1.9 W 1.6 1.4 1.2 1 0.8 0.6 0.4 0 Safe operating area parameter ...

Page 5

Typ. output characteristic parameter ° 3 10V 2.7 2.4 2.1 1.8 1.5 3V 1.2 0.9 0.6 0 0.5 1 ...

Page 6

Drain-source on-state resistance DS(on) j parameter : BSP295 0.75 0.6 0.55 0.5 0.45 0.4 0.35 98% 0.3 0.25 typ 0.2 0.15 0.1 0.05 0 -60 -20 20 ...

Page 7

Typ. avalanche energy par 3 100 15 Drain-source breakdown voltage V ...

Page 8

... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...

Related keywords